Adhesives, Electronics Assembly, and Thermal Management Solutions

Henkel supplies industrial adhesives, sealants, electronics assembly materials, encapsulants, die attach technologies, thermal interface materials, and specialty process chemistries for applications across automotive, aerospace, electronics, semiconductor, industrial manufacturing, and other markets. Its industrial portfolio includes product families and brands such as Loctite, Bonderite, Frekote, Stycast, Eccobond, and Bergquist, with chemistry, cure method, packaging, and processing requirements varying by product and application.

As an authorized Henkel distributor, Krayden supplies a selection of Henkel industrial and electronic materials and provides technical guidance for material selection, product comparison, substrate and application requirements, dispensing, and process considerations.

Markets Served by Henkel

Aerospace Automotive Automotive Aftermarket Building & Construction Components Consumer Electronics Data & Telecommunications Furniture & Interiors Industrial Maintenance & Repair Industrial Manufacturing Medical Metals Packaging & Converting Personal Hygiene Power Semiconductor Sports & Fashion

Featured Henkel Brands

Six Henkel brands covering industrial bonding, surface treatment, mold release, electronics protection, and thermal management materials.

Loctite™

Adhesives, sealants, and surface-treatment chemistries spanning structural bonding, gasketing, instant adhesives, epoxies, silicones, and electronics assembly applications.

Bonderite™

Metal pretreatment and surface technologies including industrial cleaners, conversion coatings, and related preparation chemistries for aluminum, steel, and other substrates.

Frekote™

Mold release agents, sealers, and cleaners used to support composite, rubber, and other molding operations where controlled release and mold maintenance are required.

Stycast™

Epoxy and silicone potting and encapsulation materials used to protect sensitive circuitry and electronic assemblies from mechanical and environmental exposure.

Eccobond™

Electronics protection and assembly materials including underfills, liquid encapsulants, optically clear materials, and other formulations used around semiconductor and electronic packages.

Bergquist™

Thermal interface materials for transferring heat between electronic components and heat sinks or enclosures, including gap pads, dispensable gap fillers, and thermal compounds.

Henkel adhesives and sealants application

Henkel Structural & Sealing Solutions

Adhesives & Sealants

Henkel adhesives and sealants span general-purpose and structural bonding materials alongside gasketing sealants for industrial assembly and sealing. The source portfolio includes epoxy, silicone, acrylic, anaerobic, and other product-specific chemistries. Selection depends on the substrates, cure process, required handling time, environmental exposure, joint or flange geometry, and service conditions.

Bonding Technology

Adhesives

General-purpose and structural adhesive formulations for bonding metals, plastics, composites, and other substrates across industrial applications. Selection should account for substrate compatibility, cure method, handling time, and the required mechanical and environmental performance.

LOCTITE EA 9309.3NA AERO Epoxy Paste Adhesive LOCTITE 495 Instant Adhesive

Sealing Method

Gasketing Sealants (CIPG & FIPG)

Cured-in-place and formed-in-place gasketing sealants are dispensed directly onto flanges or housings and cure into a sealing bead or gasket. Product selection depends on substrate, flange geometry, fluid exposure, cure mechanism, and service temperature.

LOCTITE SI 5900 RTV Gasketing Sealant LOCTITE 5188 Form-In-Place Gasketing Sealant

Henkel electronics encapsulation application

Henkel Electronics Protection Materials

Encapsulants & Underfills

Henkel encapsulation and underfill materials protect electronic components, interconnects, and assemblies from mechanical and environmental stresses. The source portfolio includes potting systems, liquid encapsulants, low-pressure molding materials, capillary underfills, and optically clear formulations. Selection depends on package geometry, material flow, cure method, thermal-mechanical requirements, environmental exposure, and production process.

Protection Method

Potting Materials

Liquid resin systems used to encapsulate an assembly or housing for mechanical and environmental protection. Relevant selection factors include resin chemistry, viscosity, cure profile, thermal behavior, and the required balance of rigidity, flexibility, and electrical insulation.

LOCTITE STYCAST 2850FT Epoxy Potting Compound

Encapsulation Type

Liquid Encapsulants

Dispensable encapsulation compounds, including glob-top materials, used to cover and protect electronic die, wire bonds, and package features. Flow behavior, cure conditions, package geometry, and thermal-mechanical requirements should be evaluated for the exact assembly.

LOCTITE ECCOBOND EO1061 Electronic Encapsulant

Molding Method

Low Pressure Molding

Low-pressure molding materials encapsulate delicate electronic components at reduced molding pressure and can support short production cycles. Selection depends on formulation, processing temperature, viscosity, component geometry, substrate compatibility, and the service environment.

EUREMELT 3413 Low-Pressure Molding Compound

Package Protection

Underfills

Capillary-flow underfills are dispensed beneath flip-chip, BGA, and related packages to reinforce interconnects and redistribute mechanical and thermal stress. Flow, gap size, cure schedule, package materials, and rework requirements are product-specific selection factors.

LOCTITE ECCOBOND 3593 Underfill LOCTITE ECCOBOND FP4546 Capillary Underfill

Loctite Eccobond optically clear material

Optical Property

Optically Clear Materials

Optically clear and UV-curable encapsulation materials are used where electronic protection must be combined with light transmission, such as selected display, sensor, and optoelectronic applications. Optical requirements, cure method, bond-line geometry, and substrate compatibility vary by product.

LOCTITE ECCOBOND F113 Optically Clear Material

Henkel Electronics Assembly Materials

Electronics Assembly Adhesives & Inks

Henkel electronics assembly materials include film and paste adhesive technologies used for component attachment, structural bonding, electrical interconnection, grounding, and EMI-management functions. Depending on the application, materials may be electrically conductive or insulating and may be supplied in film, paste, coating, or other product-specific formats. Selection should account for the assembly geometry, electrical function, deposition method, cure process, and production requirements.

Adhesive Format

Assembly Film Adhesives

Sheet-form adhesive materials used where controlled bond-line thickness, clean handling, and repeatable placement are important in electronics and component assembly. Selection should consider film thickness, substrate combination, lamination or cure process, and electrical requirements.

LOCTITE ABLESTIK 5020K Assembly Film Adhesive

Loctite Ablestik electrically conductive material

Electrical Function

Electrically Conductive Adhesives

Conductive adhesive and ink technologies are used for grounding, shielding, and electrical interconnection where conductivity is required in addition to mechanical attachment. Filler system, deposition method, cure process, line geometry, and required electrical performance vary by product.

LOCTITE ABLESTIK ECF 550 Conductive Film Adhesive LOCTITE ABLESTIK ECF563 Conductive Film Adhesive

Loctite Ablestik non-conductive material

Electrical Function

Non-Conductive Adhesives

Electrically insulating adhesive materials support component and package assembly where mechanical bonding is needed without creating an electrical path. Material format, cure conditions, package geometry, dielectric requirements, and process method should be confirmed for the selected product.

LOCTITE 3614 Surface-Mount Epoxy Adhesive LOCTITE ABLESTIK 77-1S Non-Conductive Epoxy Adhesive

Henkel Semiconductor Assembly Materials

Die Attach

Henkel die attach materials support bonding of semiconductor die to substrates, leadframes, and package structures using film, paste, sintering, and coating-based approaches. Required electrical conductivity, thermal transport, bond-line control, metallization, cure or sintering conditions, and production method vary by material and package design.

Material Format

Die Attach Films

Film-form die attach materials provide controlled adhesive thickness and clean handling for attaching semiconductor die to substrates or packages. Selection depends on die and substrate materials, film thickness, lamination process, cure requirements, and the required thermal or electrical function.

LOCTITE ABLESTIK CDF 200 Conductive Die Attach Film

Material Format

Die Attach Pastes

Dispensable die attach pastes are used to bond semiconductor die during package assembly and may be formulated for electrical or thermal conductivity depending on the product. Selection should consider rheology, bond-line control, cure profile, package materials, and conductivity requirements.

LOCTITE ABLESTIK 8380 Conductive Die Attach Adhesive LOCTITE ABLESTIK 84-1LMINB Conductive Die Attach Adhesive

Bonding Process

Sintering & Semi-Sintering Pastes

Sintering and semi-sintering die attach materials are selected for package designs requiring high thermal transport and robust attachment under product-specific heat and pressure conditions. Process temperature, pressure, metallization, bond-line thickness, and production method must be matched to the exact material.

LOCTITE ABLESTIK ABP 8068TB Semi-Sintering Die Attach Adhesive

Wafer Process

Wafer Backside Coatings

Conductive or adhesive coatings applied to the backside of a wafer before dicing can prepare individual die for downstream attachment or package-level functions. Selection depends on coating method, film thickness, drying or cure process, metallization, and compatibility with later die attach steps.

Henkel Thermal Management Solutions

Thermal Interface Materials

Henkel thermal interface materials support heat transfer between electronic components and heat sinks, cooling plates, or enclosures. The source portfolio includes Bergquist gap pads, dispensable one-part and two-part thermal materials, and thermal greases. Selection depends on thermal conductivity, gap thickness, compressibility or bond-line control, dielectric requirements, dispensing method, and assembly process.

Material Form

Thermal Gap Pads

Soft, compressible interface pads fill gaps between heat-generating components and heat sinks or enclosures while accommodating surface and tolerance variation. Pad thickness, compressibility, dielectric needs, thermal conductivity, and assembly pressure are key selection variables.

BERGQUIST SIL PAD TSP 1600S Thermal Interface Pad

Cure Format

Two-Part Thermal Gap Fillers & Bonding Materials

Two-component dispensable thermal materials cure in place and can combine gap filling with mechanical attachment, depending on the product. Selection should account for mix and dispense method, working time, bond-line thickness, cure conditions, and required thermal performance.

BERGQUIST GAP FILLER TGF 3600 Two-Part Thermal Gap Filler

Cure Format

One-Part Dispensable Thermal Materials

Single-component dispensable thermal materials simplify application by eliminating on-line mixing while providing conformable gap filling. Product selection depends on dispense behavior, cure or set mechanism, gap stability, storage conditions, and thermal requirements.

Material Form

Thermal Greases

Non-curing thermal compounds are applied between components and heat sinks to fill microscopic surface irregularities and reduce interface resistance. Selection should account for bond-line thickness, pump-out or migration concerns, electrical properties, application method, and service environment.

Henkel specialty chemicals and mold maintenance application

Henkel Specialty & Mold Support Materials

Specialty Chemicals, Molding Compounds & Mold Maintenance

Henkel specialty and mold-support materials include cure components, low-pressure molding compounds, mold-cleaning materials, mold-release agents, and surface-preparation chemistries. Henkel currently offers low-pressure molding materials under TECHNOMELT and LOCTITE for electronic overmolding, while process and maintenance materials support compatible resin systems, molds, and downstream bonding or coating operations.

Process Chemistry

Additives & Cure Components

Catalysts, hardeners, and related cure components are paired with compatible resin systems to initiate or control cure. The required component, mix ratio, processing window, storage conditions, and cure schedule are specific to the companion system.

Molding Technology

Low-Pressure Molding Compounds

Henkel low-pressure molding materials include thermoplastic polyamide- and polyolefin-based systems used to overmold and protect electronic devices, connectors, cables, sensors, and related assemblies. Current Henkel offerings include TECHNOMELT and LOCTITE materials selected according to process temperature, viscosity, substrate compatibility, and end-use conditions.

Maintenance Function

Mold Cleaning Compounds

Mold-cleaning materials are used to remove release residue and cured resin buildup from production tooling between manufacturing runs. Selection should consider the residue type, mold surface, cleaning method, process temperature, and compatibility with the release system used afterward.

LOCTITE FREKOTE PMC Mold Cleaner

Release Technology

Mold Release Agents

Frekote mold release materials are applied to tooling surfaces to reduce sticking and support consistent part release in composite, rubber, and other molding operations. Selection depends on mold material, molded resin or elastomer, release durability, application method, and cleaning procedure.

LOCTITE FREKOTE 770-NC Mold Release Agent LOCTITE FREKOTE 55-NC Mold Release Agent

Surface Preparation

Adhesion Primers & Promoters

Bonderite conversion coatings and primers prepare metal surfaces before bonding, painting, or related finishing processes. The appropriate treatment depends on substrate alloy, required corrosion protection, downstream adhesive or coating, application method, and process controls.

BONDERITE M-CR T5900 Conversion Coating

Talk to our Henkel Experts

Krayden can help compare Henkel materials for bonding, sealing, encapsulation, underfill, electronics assembly, die attach, and thermal management applications. Our team can support product selection, substrate and application requirements, process considerations, and comparison of candidate materials for your assembly.

Contact our team Call +1 (800) 448-0406

Henkel Quick Reference

Brands Carried

Loctite, Bonderite, Frekote, Stycast, Eccobond, Bergquist

Core Technology

Adhesives, Electronics Assembly & Thermal Management Materials

Top Categories

Adhesives & Sealants, Encapsulants & Underfills, Electronics Assembly, Die Attach

Key Markets

Electronics, Semiconductor, Aerospace, Automotive