LOCTITE ABLESTIK CE3104WXL
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Pb Free alternative to solder
- Electrically conductive
- Optimized for printing
Product Description
LOCTITE ABLESTIK CE 3104WXL is an electrically conductive epoxy adhesive that is a Pb-free alternative to solder. It is a rigid, silver filled epoxy that can be heat cured in low temperatures and is typically used for SMD component attach on non-noble Sn, Sn/Pb and OSP coated Cu substrates.
LOCTITE ABLESTIK CE 3104WXL uses a unique blend of fillers with tightly controlled particle sizes to provide ultra-fine pitch resolution (<500µm) when printed using either a stainless steel mesh screen or a metal mask stencil. The lower surface tension versus solder means no bridging on fine-pitch assembly patterns.
Cure Schedule
- Reflow:
- 3 minutes @ 150°C or
- 5 minutes @ 125°C
- Convection:
- 8 minutes @ 125°C or
- 5 minutes @ 150°C
ABLESTIK CE3104WXL
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 25 daysTDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
In the following image you can see that the CE 3104WXL stencil printing results with 25um stencil showing that 80-100um dot diameter with 100um spacing (or 200um pitch) look good, but smaller dots and pitch are getting tricky.
The results are color coded so 100um spacing exhibits proper printing with larger dot diameters.
