ABLESTIK 8380
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Reduced Tailing and Stringing in Smart-Card Assembly
- 1-Minute 150 deg C Cure
- 0.0005 ohm-cm Volume Resistivity
Product Description
LOCTITE® ABLESTIK 8380 is a silver-filled, electrically conductive epoxy adhesive developed for high-volume, reel-to-reel smart-card die-attach applications. Its rheology is formulated to support rapid automated dispensing and die placement while reducing tailing and stringing. The heat-cured adhesive provides a typical viscosity of 10,000 mPa·s at 25°C, a thixotropic index of 4.3, and guideline cure options of 1 minute at 150°C or 4 minutes at 125°C. Typical cured performance includes volume resistivity of 0.0005 ohm-cm and die shear strength of 33.1 N/mm² for an 80 mil² silicon die bonded to a silver-plated copper leadframe at room temperature.
Key features
- High-speed dispensing rheology: Formulated to reduce tailing and stringing while supporting short adhesive-dispense and die-placement dwell times.
- Fast heat cure: Guideline schedules include 1 minute at 150°C or 4 minutes at 125°C.
- Electrical conductivity: Typical cured volume resistivity is 0.0005 ohm-cm.
Applications / Suitable for
- Smart-card die attach
- High-volume reel-to-reel assembly
- High-speed automated die bonding
- Silicon-die attachment to silver-plated copper leadframes under the documented test condition
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Typical properties, storage information, and guideline cure schedules for the adhesive before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Electrically conductive die-attach adhesive |
| Appearance | Silver liquid or paste | — | TDS appearance and SDS physical state |
| pH | 4.25 | — | Test method and condition not stated |
| Viscosity | 10,000 | mPa·s | At 25°C; test method not stated |
| Thixotropic index | 4.3 | — | Test details not stated |
| Specific gravity | 3.6 | — | SDS physical-property value |
| Storage life | 365 | days | At -40°C, from date of manufacture |
| Cure schedule | 1 minute or 4 minutes | — | 1 minute at 150°C or 4 minutes at 125°C; guideline recommendations |
| Weight loss on cure | 1.3 | % | Cure profile and test method not stated |
After-processing / final-state properties
Typical cured-material properties and die-attach performance. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Coefficient of thermal expansion — below Tg | 56 | ppm/°C | TMA; cure condition not stated |
| Coefficient of thermal expansion — above Tg | 170 | ppm/°C | TMA; cure condition not stated |
| Extractable chloride | 100 | ppm | Extraction conditions and test method not stated |
| Extractable sodium | 10 | ppm | Extraction conditions and test method not stated |
| Extractable potassium | 10 | ppm | Extraction conditions and test method not stated |
| Water-extract conductivity | 65 | µmhos/cm | Extraction conditions and test method not stated |
| Weight loss at 300°C | 0.4 | % | TGA; exposure duration and cure condition not stated |
| Volume resistivity | 0.0005 | ohm-cm | Test method and cure condition not stated |
| Die shear strength — 80 mil² silicon die on silver-plated copper leadframe | 33.1 (4,800) | N/mm² (psi) | Tested at room temperature; cure condition and test method not stated |
