LOCTITE ABLESTIK 104

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE ABLESTIK 104

Main features

  • Up to 230 deg C Service
  • Long Working Time
  • High Tensile Lap Shear Strength

Product Description

LOCTITE ABLESTIK 104 is a two-component, heat-cure epoxy adhesive with an anhydride hardener (Part B), supplied as a black liquid resin and white powder mixed at a 100:64 weight ratio. This non-conductive adhesive is formulated for assembly applications requiring very high temperature exposure, supporting continuous service from -25°C to 230°C with tested short-term resistance up to 280°C. It bonds metals, glass, ceramic, and thermoset plastic substrates and offers excellent chemical resistance, high shear strength, and a long working time of over 12 hours per 100 g mixed mass at 25°C, giving assemblers an extended window for part placement before cure.

Key features

  • High-temperature performance: Withstands continuous exposure to 230°C and has been tested to survive short-term exposures up to 280°C.
  • Extended working time: Offers a working time greater than 12 hours for a 100 g mixed mass at 25°C, allowing flexible assembly and placement time before cure.
  • High shear strength, non-conductive bonding: Delivers a tensile lap shear strength of 12.4 N/mm² (1,800 psi) on aluminum-to-aluminum joints at 25°C while remaining electrically non-conductive.

Applications / Suitable for: Assembly bonding of metals, glass, ceramic, and thermoset plastic substrates in high-temperature service environments.

Product Family

ABLESTIK 104

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Liquid
Specific GravitySpecific Gravity
1.35
Physical Properties
ViscosityViscosity
25000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
225 °C
Operating TemperatureOperating Temperature
-25 to 230 °C
Electrical Properties
Volume ResistivityVolume Resistivity
10000000000000000 Ohms⋅cm

Additional Information

Electrically Non-Conductive Epoxy Adhesive

LOCTITE ABLESTIK 104

LOCTITE ABLESTIK 104 is a two-component, heat-cure epoxy assembly adhesive using an anhydride hardener. The black liquid resin and white powder hardener are mixed at 100:64 by weight. Henkel positions the material for very high-temperature assembly bonding, with continuous operating exposure from -25 to 230 deg C, documented short-term testing up to 280 deg C, electrical non-conductivity, and use on metals, glass, ceramic, and thermoset plastics.

Two-component epoxyAnhydride hardenerHeat cureElectrically non-conductive100:64 mix ratio by weightShort-term tested to 280 deg C
Material Preparation

As-supplied properties

Component-specific and mixed-material data are separated so the reported state, ratio, and working-time conditions remain clear.

Property Value Unit Method / condition
Component A appearance Black liquid - Resin, as supplied
Component B appearance White powder - Anhydride hardener, as supplied
Mixing ratio, Component A:Component B 100:64 by weight Two-component system
Viscosity, Part A 25,000 mPa s (cP) 25 deg C
Specific gravity, Part A 1.35 - As supplied
Shelf life, Part A 183 days 25 deg C
Shelf life, Part B 183 days 25 deg C
Working time >12 hours 100 g mixed mass at 25 deg C
Mixed density 1.4 g/cm^3 Mixed Parts A and B
Preparation and Cure

Mixing, application and heat cure

LOCTITE ABLESTIK 104 requires accurate weighing, thorough mixing, clean bonding surfaces, and heat cure. The published cure profiles are guideline recommendations; actual time and temperature can vary with the application, curing equipment, oven loading, and actual oven temperature.

Surface preparation: Completely clean substrates to remove oxide layers, dust, moisture, salt, oils, and other contamination that can interfere with adhesion or contribute to corrosion.
Mix ratio: Accurately weigh Component A resin and Component B hardener at 100:64 by weight in a clean container.
Initial mixing: Blend by hand with a kneading motion for 2 to 3 minutes, scraping the bottom and sides of the container frequently to produce a uniform mixture.
Optional power mixing: If possible, power mix for an additional 2 to 3 minutes. Avoid high mixing speeds because excessive air entrainment or overheating can reduce working life.
Application and pressure: Apply adhesive to all surfaces to be bonded, join the parts, and use contact pressure in applications where that is sufficient.
Cure schedules: 1 hour at 200 deg C; 2 hours at 175 deg C; 3 hours at 150 deg C; or 6 hours at 120 deg C.
Post cure: For optimum performance, follow the initial cure with 2 to 4 hours at the highest expected use temperature.
Storage and handling

Store LOCTITE ABLESTIK 104 in its original, tightly covered containers in clean, dry areas. The TDS lists an optimal storage temperature of 25 deg C and a typical shelf life of 183 days at 25 deg C for both Parts A and B. Do not return material removed from a container to the original container.

Final Material Performance

Typical cured properties

Typical cured-material data are presented with the reported method or test condition and should not be treated as guaranteed design specifications.

Property Value Unit Method / condition
Hardness 90 Shore D Cured material
Coefficient of thermal expansion 60 ppm/deg C TMA
Glass transition temperature >225 deg C DSC/TMA
Volume resistivity 10^15 ohm-cm 25 deg C
Dielectric strength 15.7 kV/mm Cured material
Total mass loss (TML) 0.52 % NASA Reference Publication 1124; sample cured 6 hours at 120 deg C
Collected volatile condensable material (CVCM) 0.08 % NASA Reference Publication 1124; sample cured 6 hours at 120 deg C
Bond Performance

Aluminum lap shear across test temperature

The reported tensile lap shear results show aluminum-to-aluminum bond strength at three test temperatures. These values are specific to the reported substrate and test temperatures and should not be generalized to other substrates, joint designs, or service conditions.

Property Value Unit Method / condition
Tensile lap shear strength at 25 deg C 12.4 (1,800) N/mm^2 (psi) Aluminum-to-aluminum
Tensile lap shear strength at 150 deg C 11.7 (1,700) N/mm^2 (psi) Aluminum-to-aluminum
Tensile lap shear strength at 230 deg C 9.7 (1,400) N/mm^2 (psi) Aluminum-to-aluminum
Chemical Exposure Data

Typical solvent and chemical resistance

The TDS reports percent weight change after 7 days of immersion at 24 deg C. These are material test results under the stated exposure condition and do not by themselves establish bonded-joint durability in every chemical environment.

Property Value Unit Method / condition
30% H2SO4 +0.19 % weight change After 7 days immersion at 24 deg C
10% NaCl +0.21 % weight change After 7 days immersion at 24 deg C
3% H2SO4 +0.26 % weight change After 7 days immersion at 24 deg C
5% Phenol +0.23 % weight change After 7 days immersion at 24 deg C
10% NaOH +0.11 % weight change After 7 days immersion at 24 deg C
Distilled H2O +0.20 % weight change After 7 days immersion at 24 deg C
1% NaOH +0.22 % weight change After 7 days immersion at 24 deg C
10% HNO3 +0.23 % weight change After 7 days immersion at 24 deg C
95% C2H5OH +0.7 % weight change After 7 days immersion at 24 deg C
10% HCl +0.22 % weight change After 7 days immersion at 24 deg C
50% C2H5OH +0.18 % weight change After 7 days immersion at 24 deg C
5% CH2COOH +0.24 % weight change After 7 days immersion at 24 deg C
Acetone +0.06 % weight change After 7 days immersion at 24 deg C
10% NH4OH +0.76 % weight change After 7 days immersion at 24 deg C
Ethyl Acetate +0.00 % weight change After 7 days immersion at 24 deg C
2% Na2CO3 +0.22 % weight change After 7 days immersion at 24 deg C
CCl4 +0.04 % weight change After 7 days immersion at 24 deg C
3% H2O2 +0.23 % weight change After 7 days immersion at 24 deg C
Toluene +0.04 % weight change After 7 days immersion at 24 deg C
10% Citric Acid +0.22 % weight change After 7 days immersion at 24 deg C
Heptane +0.02 % weight change After 7 days immersion at 24 deg C
Oleic Acid +0.09 % weight change After 7 days immersion at 24 deg C
JP-4 +0 % weight change After 7 days immersion at 24 deg C
JP-5 0 % weight change After 7 days immersion at 24 deg C
Documented Use Contexts

Assembly applications

Henkel lists LOCTITE ABLESTIK 104 for assembly bonding on metals, glass, ceramic, and thermoset plastic, particularly where very high-temperature exposure is part of the application requirement.

High-temperature assembly bonding
The product is designed for assembly applications requiring very high-temperature exposure, with a documented operating range of -25 to 230 deg C and short-term testing up to 280 deg C.
Metal assemblies
Metals are listed as key substrates, and the published tensile lap shear dataset uses aluminum-to-aluminum joints at 25, 150, and 230 deg C.
Glass, ceramic and thermoset plastic
Glass, ceramic, and thermoset plastic are also listed as key substrates for assembly bonding. Final suitability should be confirmed for the specific surface preparation, joint design, cure process, and service environment.

Product resources

Official product page
Henkel LOCTITE ABLESTIK 104 product page
Official exact-product page with current public product positioning and technical summary, including high-temperature service, two-part heat cure, substrate guidance, and aluminum shear information.
View official product page
Next steps

Evaluate LOCTITE ABLESTIK 104 for high-temperature bonding

Krayden can help review substrate preparation, 100:64 weighing and mixing, cure schedule, post-cure strategy, bondline and pressure considerations, and the temperature and chemical exposure conditions relevant to evaluating LOCTITE ABLESTIK 104. Discuss your assembly geometry, target service temperature, and qualification requirements before establishing production parameters.

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