LOCTITE EDAG PF 021 E&C
Harmonization Code : 32159090 | Printing ink, writing or drawing ink, and other inks, whether or not concentrated or solid, specifically for those classified as other within that category
Main features
- Encapsulating Photopolymer
- Prevents Silver migration
- Fast UV Cure
Product Description
LOCTITE EDAG PF 021 E&C encapsulating photopolymer is designed to secure low profile surface mount devices (SMD) to rigid or flexible substrates. It is particularly effective for use as a physical and environmental protection of the mounted device.
LOCTITE EDAG PF 021 E&C is a UV curable, clear thermoplastic with a fast UV cure that prevent silver migration and physically protects SMD. It offers ease of process and dot dispensing with a max operating temperature of 204°C.
TDS, SDS & Technical Documents
Technical Specifications
Mechanical Properties
Physical Properties
Additional Information
Recommended UV Cure
Light Dose, Joule/cm2: 0.4 to 1.0
For thicknesses >2.0 mils, a longer wavelength bulb is required e.g. Fusion "D". UV measurements were made with an EIT radiometer.
How to use:
1. Mixing/Dilution
- Product is ready for use but should be mixed thoroughly using a plastic spatula. (Syringe-packed material needs no mixing).
- Mix smoothly from bottom of container , being careful not to whip air into the product.
2. Application
- LOCTITE EDAG PF 021 E&C should be applied in a glob over the entire surface if small devices, or along the outside leads of large devices.
- Its viscosity is designed to conform to the device and flow out over the substrate just prior to UV curing.
- Dot dispensing equipment should be selected based on the exact application, i.e., device size and production speed.
3. Cleanup
- Uncured resin may be cleaned with Isopropanol,
