LOCTITE EA E214HP
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- One-Component, No-Mix Epoxy Paste Simplifies Material Preparation
- 37 N/mm^2 Stainless-Steel Lap Shear
- 22 kV/mm Dielectric Strength
Product Description
LOCTITE EA E-214HP is a one-component, no-mix, heat-activated epoxy adhesive supplied as a light grey thixotropic paste. It is designed to form tough structural bonds on prepared metals, glass, ceramics, selected plastics, and wood. The cured adhesive combines strong substrate-specific shear performance with a glass transition temperature of 120 degrees C, Shore D hardness of 85, and dielectric breakdown strength of 22 kV/mm. Its thixotropic rheology supports controlled placement, while the documented cure and bondline guidance helps users evaluate it for assemblies that can accommodate a heat-cure process.
Key features
- One-component heat-cure epoxy: Requires no mixing before application.
- Thixotropic light grey paste: Supports controlled adhesive placement and bondline management.
- Prepared-metal lap shear: Typical values include 37 N/mm2 on stainless steel and 33 N/mm2 on grit-blasted steel after the stated cure.
- Cured thermal and electrical properties: Typical glass transition temperature is 120 degrees C and dielectric breakdown strength is 22 kV/mm.
- Documented environmental resistance: Retained-strength data are available for heat, fluids, solvents, humidity, water, and salt-fog exposure under defined test conditions.
Applications / Suitable for
- Prepared steel, stainless steel, and aluminum bonding
- Glass and ceramic bonding
- Selected plastic bonding, including polycarbonate, nylon, PVC, and acrylic, subject to application testing
- Wood bonding where the assembly can accommodate the required heat-cure process
TDS, SDS & Technical Documents
Technical Specifications
No specifications available.
Additional Information
LOCTITE EA E-214HP
A one-component, no-mix, heat-activated epoxy adhesive supplied as a light grey thixotropic paste. It is formulated for tough structural bonding across prepared metals and selected non-metallic substrates, with documented mechanical, dielectric, chemical-resistance, and temperature-dependent performance.
LOCTITE EA E-214HP one-component heat-cure epoxy adhesive.
As-supplied properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology / chemical type | Epoxy | As supplied | |
| Appearance | Light grey paste | As supplied | |
| Components | One | No mixing required | |
| Rheology | Thixotropic | As supplied | |
| Specific gravity | 1.11 | At 25 degrees C | |
| Brookfield viscosity | 2,000,000 to 3,000,000 | mPa s (cP) | RVT, spindle 7, 1 rpm, 25 degrees C |
| Brookfield viscosity | 800,000 to 1,500,000 | mPa s (cP) | RVT, spindle 7, 2.5 rpm, 25 degrees C |
| Cure mechanism | Heat cure | Cure at 120 degrees C or above until firm |
Processing and application
Bond performance depends on clean surfaces, even adhesive coverage, controlled assembly, and a complete heat-cure cycle. Keep parts from moving while the adhesive cures.
Store at or below 4 degrees C in the original, tightly closed container in a cool, dry, well-ventilated location away from heat, sparks, flame, direct sunlight, and incompatible materials. Do not return removed material to the original container. Use adequate ventilation and appropriate protective gloves, clothing, and eye and face protection. Do not use solvents to clean hands. Uncured excess may be removed with a ketone-type solvent using appropriate controls. Heating may cause a fire, and storage above 4 degrees C can adversely affect product properties. Avoid sections greater than 6 mm because exothermic heat buildup can cause rapid expansion, blistering, or cracking. Do not use the product in pure oxygen or oxygen-rich systems, and do not select it as a sealant for chlorine or other strong oxidizing materials.
Cured material properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass transition temperature | 120 | degrees C | ISO 11359-2 |
| Shore hardness | 85 | Shore D | ISO 868 |
| Elongation at break | 7 | % | ISO 527-2 |
| Tensile strength | 31 | N/mm2 | ISO 527-2; 4,460 psi |
| Dielectric breakdown strength | 22 | kV/mm | IEC 60243-1 |
Bonding and environmental performance
The following values are typical laboratory results for the specified substrates, surface preparations, cure schedules, bondlines, and exposure conditions. They should be used for product evaluation rather than as guaranteed design allowables.
Applications and substrate evaluation
The product is documented for bonding metals, glass, ceramics, plastics, and wood. Strength depends on substrate grade, surface preparation, joint geometry, bondline, and cure, so representative application testing remains important.
Evaluate LOCTITE EA E-214HP for your bonded assembly
Contact Krayden to review substrate preparation, dispensing, heat-cure capability, target bondline, joint design, and the mechanical, electrical, or environmental data most relevant to your application.
