ABLESTIK 816H01
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- 2.0 W/(m K) Thermal Interface
- Three-Hour Working Window
- Room-Temperature Thermal Interface Cure
Product Description
LOCTITE® ABLESTIK 816H01 is a two-component, thermally conductive and electrically insulating epoxy adhesive for component assembly. The white, thixotropic system mixes at 100:15 by weight and is intended for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive components to printed circuit boards. It develops high-impact bonds while supporting heat transfer and electrical isolation. The adhesive provides a typical mixed viscosity of 5,000 mPa·s at 25°C, a three-hour work life for a 25 g mass, and room-temperature or accelerated heat-cure options.
Key features
- Thermally conductive and electrically insulating: Typical cured thermal conductivity is 2.0 W/(m·K), supporting heat transfer while maintaining electrical isolation.
- Thixotropic processing: A typical mixed viscosity of 5,000 mPa·s at 25°C supports controlled component-staking application.
- Room-temperature or heat cure: Guideline schedules include 24 hours at 25°C or 2 to 4 hours at 65°C.
Applications / Suitable for
- Staking transistors, diodes, resistors, and integrated circuits to printed circuit boards
- Assembly of heat-sensitive electronic components
- Non-conductive component bonding
- Bonding metals, silica, steatite, alumina, sapphire, ceramics, glass, and plastics
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical mixed properties, handling characteristics, and guideline cure schedules before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Two-component adhesive system |
| Appearance | White | — | Mixed adhesive |
| Mix ratio — resin:hardener | 100:15 | by weight | Resin-to-hardener ratio |
| Mixed viscosity | 5,000 | mPa·s (cP) | Brookfield RV, spindle 3, at 25°C |
| Specific gravity — mixed | 1.300 | — | TDS reports the value as “1,300”; decimal interpretation requires confirmation |
| Pot life | 1 | hour | 25 g mass; temperature not stated |
| Work life | 3 | hours | 25 g mass; temperature not stated |
| VOC content | 8.12 | g/L | Mixed adhesive; method not stated |
| Cure schedule | 24 hours or 2–4 hours | — | 24 hours at 25°C or 2 to 4 hours at 65°C; guideline recommendations |
| Optimal storage | 27 | °C | TDS optimal-storage value; component SDSs state storage at or below 25°C |
After-processing / final-state properties
Typical physical, thermal, outgassing, and bonded-joint properties of the cured adhesive. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating-temperature range | -70 to 115 | °C | Documented product range |
| Hardness | 80 | Shore D | Cure condition and test method not stated |
| Glass-transition temperature | 54 | °C | Method and cure condition not stated |
| Coefficient of thermal expansion | 4.0 × 10-5 | cm/cm/°C | Temperature range, test method, and cure condition not stated |
| Thermal conductivity | 2.0 | W/(m·K) | Test method, temperature, specimen geometry, and cure condition not stated |
| Reactive solids content | 100 | % | Typical value |
| Total mass loss | 0.6 | % | TML; sample cured 3 hours at 65°C |
| Collected volatile condensable material | 0.02 | % | CVCM; sample cured 3 hours at 65°C |
| Lap shear strength — aluminum to aluminum | 1,700 | psi | Surface preparation, bondline, cure condition, test method, and test temperature not stated |
