LOCTITE ABLESTIK 2035SC
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Low cure temperature
- Smart card applications
- Fast cure
Product Description
LOCTITE® ABLESTIK 2035SC non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimise stress and resulting warpage between dissimilar surfaces.
LOCTITE® ABLESTIK 2035SC is isothermal and based on a proprietary hybrid chemistry that offers low stress and cures fast in relatively low temperatures. This combination makes it ideal for snap cure smart card applications.
Cure Schedule
- 90 seconds @ 110°C
- 60 seconds @ 120°C or 10 seconds @ 150°C
ABLESTIK 2035SC
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications
General Properties
Physical Properties
Thermal Properties
Additional Information
LOCTITE ABLESTIK 2035SC is isothermal at 80°C.
The following DSC graph shows 9.9mg on a 40°C/min ramp from 40-80°C with 15min dwell.
