ABLESTIK 2248

Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm

ABLESTIK 2248

Main features

  • Thixotropic Application Control
  • 14.8 kV/mm Dielectric Strength
  • 1-Hour Working Window

Product Description

LOCTITE® ABLESTIK 2248 BIPAX is a two-component, heat-cured epoxy staking compound supplied in a mixing-dispenser package. The tan, thixotropic system mixes at 100:19.4 resin-to-hardener by weight and is documented for bonding metals, glass, ceramics, and plastics. It combines toughness, impact resistance, thermal-shock resistance, and low permeability to gases and vapors with a two-hour pot life and a guideline cure schedule of 1 hour at 100°C. Typical cured properties include an operating-temperature range of -60 to 190°C, Shore D hardness of 87, tensile strength of 72.4 N/mm², and volume resistivity of 2.50 × 1015 ohm-cm at 25°C.

Key features

  • Tough, thermally durable system: Documented for good toughness, impact resistance, thermal-shock resistance, and service from -60 to 190°C.
  • Controlled thixotropic handling: Typical mixed viscosity is 10,000 mPa·s at 25°C with a two-hour pot life.
  • Electrical insulation: Typical cured volume resistivity is 2.50 × 1015 ohm-cm at 25°C, with dielectric strength of 14.8 kV/mm.

Applications / Suitable for

  • Staking applications
  • Bonding metals, glass, ceramics, and plastics
  • Assemblies exposed to thermal shock or elevated service temperatures
  • Applications requiring low permeability to gases and vapors
Product Family

ABLESTIK 2248

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Tan
Chemistry TypeChemistry Type
Epoxy
Mix RatioMix Ratio
100 : 19.4
Pot LifePot Life
2 hours
Specific GravitySpecific Gravity
1.2
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
109.0 °C
Operating TemperatureOperating Temperature
-60 to 190 °C
Mechanical Properties
ElongationElongation
2 %
Chemical Properties
Water AbsorptionWater Absorption
0.001 %
Electrical Properties
Dielectric StrengthDielectric Strength
14.8 kV/mm
Volume ResistivityVolume Resistivity
2.50×10¹⁵ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical mixed, handling, storage, and guideline cure information before final processing.

Property Value Unit Method / condition
Technology Epoxy Two-component heat-cured staking compound
Appearance — mixed Tan Uniformly mixed BIPAX system
Appearance — resin Light yellow liquid LOCTITE ABLESTIK 2248-R SDS
Appearance — hardener Amber to brown liquid LOCTITE ABLESTIK 2248-H SDS
Mix ratio — resin:hardener 100:19.4 by weight Documented BIPAX mix ratio
Mixed viscosity 10,000 mPa·s (cP) Brookfield LV, spindle 4, 12 rpm at 25°C
Specific gravity — mixed 1.2 Typical mixed value
Specific gravity — resin 1.3 LOCTITE ABLESTIK 2248-R SDS
Specific gravity — hardener 1.0 LOCTITE ABLESTIK 2248-H SDS
Pot life 2 hours Temperature and test mass not stated
Guideline cure schedule 1 hour At 100°C
Application-dependent post-cure 2 hours At 125°C when anticipated application temperatures exceed 125°C
Optimal storage ≤27 °C TDS storage value; component SDSs specify storage at or below 25°C
Technical properties

After-processing / final-state properties

Typical cured physical, thermal, electrical, outgassing, and bonded-joint properties. Values are reference data and are not product specifications.

Property Value Unit Method / condition
Operating-temperature range -60 to 190 °C Documented product range
Hardness 87 Shore D Cure condition and test method not stated
Glass-transition temperature 109 °C Method and cure condition not stated
Coefficient of expansion 50 ppm/°C Temperature range, method, and cure condition not stated
Heat-distortion temperature 148 °C Method and cure condition not stated
Water absorption 0.001 % After 24-hour immersion
Izod impact strength 0.52 ft-lb/in of notch Test method and cure condition not stated
Elongation 2 % Test method and cure condition not stated
Dielectric strength 14.8 kV/mm Test method, specimen thickness, and cure condition not stated
Dielectric constant 4.35 At 1 kHz and 25°C
Dissipation factor 0.02 At 1 kHz and 25°C
Volume resistivity 2.50 × 1015 ohm-cm At 25°C
Outgassing Passes ASTM E595-90
Lap shear strength — aluminum to aluminum 17.9 (2,600) N/mm² (psi) Surface preparation, bondline, cure condition, test method, and test temperature not stated
Tensile strength 72.4 (10,500) N/mm² (psi) Test method and cure condition not stated

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