ABLESTIK 77-1S
Harmonization Code : 3919.10.80 | Other self-adhesive plastic rolls not exceeding 20 cm wide.
Main features
- One-Component, Solvent-Free Epoxy for Attaching Surface-Mounted Devices
- Smooth Non-Tailing Non-Sag Consistency
- 91-Day Working Window
Product Description
LOCTITE® ABLESTIK 77-1S is a one-component, solvent-free epoxy adhesive designed for attaching surface-mounted devices to printed circuit boards before wave soldering. The blue material combines electrical insulation and moisture resistance with a soft, smooth consistency formulated to resist tailing and sagging during screening, pin-transfer, or dot-dispensing processes. It provides a typical viscosity of 47,000 mPa·s at 25°C and a 91-day work life at 25°C. Guideline heat-cure schedules range from 3 minutes at 150°C to 10 seconds at 200°C.
Key features
- Controlled adhesive placement: Soft, smooth consistency with no tailing or sagging supports screening, pin transfer, and dot dispensing.
- Electrically insulating: Typical cured volume resistivity is 1.3 × 1012 ohm-cm.
- Fast heat cure: Guideline schedules include 3 minutes at 150°C, 2 minutes at 175°C, or 10 seconds at 200°C.
Applications / Suitable for
- Attaching surface-mounted devices to printed circuit boards before wave soldering
- Screening, pin-transfer, and dot-dispensing processes
- Ceramic capacitor, thick-film resistor, and SOT attachment
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Typical properties, work-life information, storage conditions, and guideline cure schedules before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | One-component, solvent-free adhesive |
| Appearance | Blue liquid | — | As supplied |
| Viscosity | 47,000 | mPa·s (cP) | Brookfield CP51, 5 rpm at 25°C |
| Specific gravity | 1.5 | — | SDS physical-property value |
| VOC content | 0.2 | g/L | SDS value; method not stated |
| Work life | 91 | days | At 25°C |
| Shelf life | 91 | days | At 5°C |
| Shelf life | 365 | days | At -40°C |
| Recommended cure schedule | 3 | minutes | At 150°C; guideline recommendation |
| Alternative cure schedules | 2 minutes or 10 seconds | — | 2 minutes at 175°C or 10 seconds at 200°C; guideline recommendations |
| Optimal storage | -40 | °C | Store unopened in a dry location; do not refreeze after thawing to 25°C |
After-processing / final-state properties
Typical physical, thermal, electrical, moisture-exposure, and bonded-joint properties of the cured adhesive. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass-transition temperature | 200 | °C | Method and cure condition not stated |
| Coefficient of thermal expansion — below Tg | 55 | ppm/°C | TMA; cure condition not stated |
| Coefficient of thermal expansion — above Tg | 110 | ppm/°C | TMA; cure condition not stated |
| Thermal conductivity | 0.5 | W/(m·K) | At 121°C; method, specimen geometry, and cure condition not stated |
| Hardness | 94 | Shore D | Cure condition and test method not stated |
| Weight loss at 250°C | 0.33 | % | Test method, exposure duration, and cure condition not stated |
| Volume resistivity | 1.3 × 1012 | ohm-cm | Test method and cure condition not stated |
| Volume resistivity after water immersion | 1.1 × 1011 | ohm-cm | After 24 hours of water immersion; immersion temperature, test method, and cure condition not stated |
| Dielectric constant | 4.6 | — | At 1 kHz |
| Dissipation factor | 0.017 | — | At 1 kHz |
| Device shear strength — ceramic capacitors | 1,000 | grams | Device dimensions, cure condition, test method, and test temperature not stated |
| Device shear strength — thick-film resistors | 2,000 | grams | Device dimensions, cure condition, test method, and test temperature not stated |
| Device shear strength — SOTs | 3,000 | grams | Device dimensions, cure condition, test method, and test temperature not stated |
| Lap shear strength — aluminum to aluminum | 13.79 (≥2,000) | N/mm² (psi) | Tested at 25°C; surface preparation, bondline, cure condition, and test method not stated |
