ABLESTIK 77-2LTC
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- One-Component, Solvent-Free Epoxy for Attaching Surface-Mount Devices
- Smooth Non-Tailing Non-Sag Consistency
- 2.5 x 10^14 ohm-cm Volume Resistivity
Product Description
LOCTITE® ABLESTIK 77-2LTC is a one-component, solvent-free epoxy adhesive designed for attaching surface-mount devices to printed circuit boards before wave soldering. The blue, electrically insulating material has a soft, smooth consistency and is formulated to resist tailing and sagging during screening, pin-transfer, or dot-dispensing processes. It provides a typical viscosity of 33,000 mPa·s at 25°C and a three-day work life at 25°C. Guideline heat-cure schedules range from 30 minutes at 80°C to 5 minutes at 150°C.
Key features
- Controlled dispensing: Soft, smooth consistency with no tailing or sagging supports small, uniform adhesive-dot placement.
- Electrically insulating: Typical cured volume resistivity is 2.5 × 1014 ohm-cm.
- Flexible heat-cure options: Guideline schedules include 30 minutes at 80°C, 15 minutes at 100°C, 10 minutes at 125°C, or 5 minutes at 150°C.
Applications / Suitable for
- Attaching surface-mount devices to printed circuit boards before wave soldering
- Capacitor attachment
- Resistor attachment
- Screening, pin-transfer, and dot-dispensing processes
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Typical properties, work-life information, storage conditions, and guideline cure schedules before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | One-component adhesive |
| Appearance | Blue liquid paste | — | TDS appearance and SDS physical-state description |
| Viscosity | 33,000 | mPa·s (cP) | At 25°C; method not stated |
| Specific gravity | 1.5 | — | SDS physical-property value |
| Work life | 3 | days | At 25°C |
| Shelf life | 365 | days | At -40°C |
| Shelf life | 3 | days | At 25°C |
| Recommended cure schedule | 30 | minutes | At 80°C; guideline recommendation |
| Alternative cure schedules | 15, 10, or 5 | minutes | 15 minutes at 100°C, 10 minutes at 125°C, or 5 minutes at 150°C; guideline recommendations |
| Optimal storage | -40 | °C | Store unopened in a dry location; do not refreeze after thawing to 25°C |
After-processing / final-state properties
Typical physical, thermal, ionic, electrical, and bonded-joint properties of the cured adhesive. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass-transition temperature | 80 | °C | Method and cure condition not stated |
| Coefficient of thermal expansion — below Tg | 44 | ppm/°C | TMA; cure condition not stated |
| Coefficient of thermal expansion — above Tg | 86 | ppm/°C | TMA; cure condition not stated |
| Hardness | 90 | Shore D | Cure condition and test method not stated |
| Weight loss at 300°C | 0.24 | % | Test method, exposure duration, and cure condition not stated |
| Thermal conductivity | 0.5 | W/(m·K) | At 121°C; method, specimen geometry, and cure condition not stated |
| Extractable chloride | 30 | ppm | Test method and extraction conditions not stated |
| Extractable sodium | 5 | ppm | Test method and extraction conditions not stated |
| Extractable potassium | 5 | ppm | Test method and extraction conditions not stated |
| Volume resistivity | 2.5 × 1014 | ohm-cm | Test method and cure condition not stated |
| Dielectric constant | 4.2 | — | At 1 kHz |
| Dissipation factor | 0.0078 | — | At 1 kHz |
| Device shear strength — ceramic capacitors | 1,000 | grams | Device dimensions, test method, cure condition, and test temperature not stated |
| Device shear strength — SOTs | 2,000 | grams | Device dimensions, test method, cure condition, and test temperature not stated |
| Device shear strength — thick-film resistors | 3,000 | grams | Device dimensions, test method, cure condition, and test temperature not stated |
| Lap shear strength — aluminum to aluminum | 15 (2,300) | N/mm² (psi) | Tested at 25°C; surface preparation, bondline, cure condition, and test method not stated |
