LOCTITE ECCOBOND FP4545FC
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High purity
- Rigid, low stress seal
- Good toughness
Product Description
LOCTITE ECCOBOND FP4545FC epoxy encapsulant designed as underfill and helps dissipate stress on solder joints and extends thermal cycling performance. This material is specially suited for flip-chip devices requiring improved crack/fracture resistance and noclean flux compatibility.
LOCTITE ECCOBOND FP4545FC is a one component, high purity underfill that forms a rigid, low-stress seal. It has good toughness and a filler weight of 55%.
Cure Schedule
- 60 minutes @ 165°C
- 120 minutes @ 170°C (enhanced performance)
ECCOBOND FP4545FC
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