ABLESTIK 550
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Film-Format Bonding for Difficult Surfaces
- 30-Minute 150 deg C Cure
- 39 N/mm^2 Aluminum Lap Shear
Product Description
LOCTITE ABLESTIK 550 is a translucent, thermally conductive epoxy film adhesive for microelectronic substrate attach and package sealing. The glass-fabric-supported film is designed for gold, gold-plated, and difficult-to-bond surfaces and is heat cured under pressure for adherend wetting. A primary cure of 30 minutes at 150 degC and an alternate cure of 2 hours at 125 degC are documented. The film has a typical 183-day work life at 25 degC and 365-day shelf life at -40 degC. Because methanol, water, and ammonia are released during cure, use in hermetically sealed packages is not recommended.
Key features
- Thermally conductive film: Epoxy film with a typical cured thermal conductivity of 0.2 W/(m-K) at 121 degC.
- Controlled film construction: Translucent film with glass-fabric carrier and documented film-thickness options by carrier thickness.
- Heat-cure processing: Primary 30-minute cure at 150 degC or alternate 2-hour cure at 125 degC, with pressure recommended during cure.
Applications / Suitable for
- Microelectronic substrate attach
- Sealing non-hermetic microelectronic packages
- Bonding gold, gold-plated, and difficult-to-bond surfaces
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
LOCTITE ABLESTIK 550
A translucent, glass-fabric-supported epoxy film adhesive for microelectronic substrate attach and package sealing. It is thermally conductive and designed for gold, gold-plated, and difficult-to-bond surfaces. The film is heat cured under pressure and is not recommended for hermetically sealed packages because volatile species are released during cure.
As-Supplied Properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology / form | Epoxy film | As supplied | |
| Appearance | Translucent | As supplied | |
| Adhesive film thickness | 3 | mil | Supplier-listed adhesive film thickness |
| Carrier type | Glass fabric | Supported film construction | |
| Film thickness | 3 to 10 | mil | 1 mil carrier |
| Film thickness | 4 to 10 | mil | 2 mil carrier |
| Film thickness | 8 | mil | 4 mil carrier |
| pH | 9 | As supplied | |
| Work life | 183 | days | 25 degC |
| Shelf life | 365 | days | -40 degC |
Processing and Cure
Allow the frozen film to reach ambient temperature before opening and remove any moisture from the package. Place the precut film between clean bonding surfaces, assemble the components, apply continuous pressure, and cure in a preheated oven. Cure temperatures are specified at the bondline. The film releases methanol, water, and ammonia during cure and is not recommended for hermetically sealed packages.
Store the film at -40 degC for up to one year. The stated shelf life is valid only when the specified storage condition is maintained. Avoid flexing the film while frozen. Before use, allow the material and package to reach ambient temperature, do not open the package while cold, and remove any collected moisture before opening.
Cured Properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Coefficient of thermal expansion, below Tg | 95 | ppm/degC | Cured material |
| Coefficient of thermal expansion, above Tg | 480 | ppm/degC | Cured material |
| Glass transition temperature | 105 | degC | Cured material |
| Thermal conductivity | 0.2 | W/(m-K) | 121 degC |
| Tensile modulus | 4,207 | N/mm2 | DMTA, -65 degC |
| Tensile modulus | 3,793 | N/mm2 | DMTA, 25 degC |
| Tensile modulus | 2,200 | N/mm2 | DMTA, 150 degC |
| Tensile modulus | 1,517 | N/mm2 | DMTA, 250 degC |
| Extractable chloride | 45 | ppm | 100 degC |
| Extractable sodium | 10 | ppm | 100 degC |
| Extractable potassium | 1 | ppm | 100 degC |
| Water extract conductivity | 220 | umhos/cm | Cured material |
| Weight loss | 1.1 | % | 300 degC |
| Moisture absorption at saturation | 2.2 | wt.% | 85 degC / 85 RH |
| Volume resistivity | 1 x 10^14 | ohm-cm | Cured material |
| Dielectric strength | 1360/25 | volts/um | As reported |
| Dielectric constant | 4.8 | 1 kHz | |
| Dissipation factor | 0.015 | 1 kHz | |
| Lap shear strength, Al to Al | 39 | N/mm2 | 1.27 cm overlap, 25 degC; 5,700 psi |
| Lap shear strength, Au to Au | 37 | N/mm2 | 1.27 cm overlap, 25 degC; 5,300 psi |
Evaluate LOCTITE ABLESTIK 550 for Your Film-Bonding Process
Krayden can support evaluation of film thickness, carrier construction, gold or difficult-to-bond surfaces, pressure and cure selection, storage and thawing, and the non-hermetic package limitation. Contact us to discuss how the documented processing and cured-property data relate to your assembly and qualification requirements.
