FREKOTE R100

Harmonization Code : 3403.19 | Lubricating Preparations (With 70% or More Petroleum Oils) For Automotive and Other Uses

FREKOTE R100

Main features

  • Multi-Cycle Mold Release
  • Reduced Resin Adhesion to Molds
  • Semi-Permanent Low-Residue Coating

Product Description

LOCTITE® FREKOTE® R-110 is a high-performance semi-permanent release coating for semiconductor molds, designed to minimize sticking and flash during transfer, compression, and injection molding. It protects mold surfaces while supporting consistent package demolding across multiple cycles.

Key features

  • Consistent release: Maintains multiple cycles without reapplication.
  • Mold protection: Reduces resin adhesion and extends tool life.
  • Semi-permanent coating: Balances long-term release with easy maintenance.
LOCTITE® FREKOTE® R-110 product container

LOCTITE® FREKOTE® R-110 container

Product Family

FREKOTE R100

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Clear Amber
Specific GravitySpecific Gravity
0.715

Additional Information

Semiconductor Mold Maintenance

LOCTITE® FREKOTE® R-110

Semi-permanent mold-release coating for semiconductor molds providing consistent release, mold protection, and minimized flash during high-volume transfer, compression, and injection molding operations.

Consistent release Mold protection Semi-permanent
LOCTITE® FREKOTE® R-110 product container

LOCTITE® FREKOTE® R-110 container

Form
Liquid / Sprayable
Ready-to-use release coating
Shelf Life
24 months
Original container, stored per Henkel guidelines
Appearance
Clear amber film
Dry semi-permanent coating

Processing Summary

Surface Preparation: Ensure mold surface is clean of cured resin and debris.
Application: Apply a thin uniform coat by spraying or brushing; allow flash-off before molding.
Post-Application: Inspect film uniformity; reapply thin layers as needed to maintain release performance.
Release Performance
Multiple molding cycles
Maintains release up to 175°C
Residue
Minimal
Reduces package contamination risk

Applications

Transfer Molding
Encapsulated semiconductor packages with consistent release.
Compression Molding
Epoxy-molded devices maintaining surface integrity.
Injection Molding
High-density leadframe packages with minimized flash.

Product Resources

FREKOTE Mold Release Solutions Guide
Comprehensive brochure detailing FREKOTE products, mold-release solutions, and application guidance.

Need Technical Assistance?

Contact Krayden’s technical experts for guidance on mold-release application, process optimization, and product evaluation for LOCTITE® FREKOTE® R-110.

Contact Krayden

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  • Jabil
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  • NXP
  • Philips
  • Semikron
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  • ZF
  • AMS
  • Apple
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  • Broadcom
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  • Eaton
  • Henkel
  • Honeywell
  • Hysol
  • Intel
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