Loctite Ablestik 83C Conductive Epoxy Adhesive
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Silver-Filled Epoxy Adhesive
- 0.0004 ohm-cm Volume Resistivity
- Electrical-Connection Epoxy Bonding
Product Description
LOCTITE® ABLESTIK 83C is a silver-filled, electrically conductive epoxy adhesive resin supplied as a smooth, thixotropic paste. Used with Catalyst 9 or Catalyst B 97, it forms conductive bonded connections to documented substrates including metals, glass, ceramics, and plastics. The adhesive is intended for electrical connections where hot soldering is impractical and for connections to conductive plastics that cannot be exposed to high temperatures. Catalyst selection provides either a general-purpose system with a shorter working life or a heat-cured system with a longer working life and higher documented use temperature.
Key features
- Electrically conductive epoxy: Silver-filled formulation develops a typical cured volume resistivity of 0.0004 ohm-cm with either documented curing agent.
- Thermally conductive bondline: Typical cured thermal conductivity is 2.6 W/m·K when prepared with Catalyst 9 or Catalyst B 97.
- Two curing-agent options: Catalyst 9 provides a 45-minute working life at 25°C, while Catalyst B 97 provides a 24-hour working life and a higher documented use-temperature range.
Applications / Suitable for
- Electrical connections where hot soldering is impractical
- Electrical connections to conductive plastics that cannot be subjected to high temperatures
- Bonding documented metal, glass, ceramic, and plastic substrates where electrical conductivity is required
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Additional Information
As-supplied / before-processing properties
Typical properties. Mixed-system values depend on the curing agent and specified mix ratio.
| Property | Value | Unit | Method or condition |
|---|---|---|---|
| Chemical type | Epoxy | — | ABLESTIK 83C resin as supplied |
| Appearance | Silver, thixotropic paste | — | Visual; resin as supplied |
| Density | 3.00 | g/cm³ | TP-13; resin as supplied |
| Curing-agent viscosity | Catalyst 9: 0.080–0.105 Catalyst B 97: 4–8 |
Pa·s | Equivalent source values: 80–105 cP and 4,000–8,000 cP |
| Mix ratio | Catalyst 9: 3.5 Catalyst B 97: 1.0 |
parts by weight | Amount of curing agent per 100 parts of ABLESTIK 83C resin |
| Working life | Catalyst 9: 45 minutes Catalyst B 97: 24 hours |
— | ERF 13-70; 100 g mixed material at 25°C |
| Mixed density | Catalyst 9: 2.81 Catalyst B 97: 2.95 |
g/cm³ | TP-13; mixed system |
After-processing / final-state properties
Typical cured properties. Values depend on the selected curing agent and documented cure schedule.
| Property | Value | Unit | Method or condition |
|---|---|---|---|
| Tensile lap-shear strength | Catalyst 9: 6.8 Catalyst B 97: 9.6 |
MPa | TP-21; aluminum-to-aluminum; tested at 25°C; source equivalents 1,000 psi and 1,400 psi |
| Coefficient of thermal expansion | 45 | 10−6/°C | TMA; Catalyst 9 and Catalyst B 97 systems |
| Thermal conductivity | 2.6 | W/m·K | ASTM D2214; Catalyst 9 and Catalyst B 97 systems; source equivalent 18 Btu-in/hr-ft²-°F |
| Temperature range of use | Catalyst 9: −40 to +130 Catalyst B 97: −55 to +155 |
°C | Documented range by curing-agent system |
| Volume resistivity at 25°C | 0.0004 | ohm-cm | TP-296; Catalyst 9 and Catalyst B 97 systems |
| Total mass loss | 0.64 | % | NASA outgassing; sample cured 1 hour at 66°C; curing-agent system not identified |
| Collected volatile condensable material | 0.02 | % | NASA outgassing; sample cured 1 hour at 66°C; curing-agent system not identified |
