ABLESTIK 59C
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 7 W/(m K) Thermal Conductivity
- 55 to 260 deg C Service Range
- Reworkable Bonding Material
Product Description
LOCTITE® ABLESTIK 59C is a one-component, silver-filled silicone adhesive for high-temperature assembly applications requiring electrical and thermal conductivity without high bond strength. The pressure-sensitive, solvent-containing material combines high flexibility, high tack, and reworkability and may be used in either its cured or uncured state. It has 85% solids, a typical density of 2.4 g/cm³, and a guideline cure schedule of 6 hours at 150°C. Typical cured properties include thermal conductivity of 7 W/(m·K), volume resistivity of 0.0002 ohm-cm at 25°C, and an operating-temperature range of -55 to 260°C.
Key features
- Electrical and thermal conductivity: Typical cured properties include volume resistivity of 0.0002 ohm-cm at 25°C and thermal conductivity of 7 W/(m·K).
- High-temperature capability: Documented operating-temperature range of -55 to 260°C.
- Flexible, reworkable bonding: Pressure-sensitive silicone construction provides high flexibility and tack for applications that do not require high bond strength.
Applications / Suitable for
- High-temperature assembly applications requiring electrical conductivity
- Thermally conductive assembly where high bond strength is not required
- Pressure-sensitive and reworkable conductive bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical composition, physical properties, storage information, and guideline cure conditions before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Silicone | — | One-component, solvent-containing material |
| Appearance | Silver liquid paste | — | As supplied |
| Filler type | Silver | — | Conductive filler |
| Solids content | 85 | % | Typical TDS value |
| Density | 2.4 | g/cm³ | As supplied |
| VOC content | 15 | % | SDS physical-property value |
| Shelf life | 6 | months | At 25°C |
| Cure schedule | 6 | hours | At 150°C; guideline recommendation |
| Optimal storage | 25 | °C | Store in original, tightly covered containers in clean, dry areas |
After-processing / final-state properties
Typical thermal, electrical, and bonded-joint properties of the cured silicone material. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating-temperature range | -55 to 260 | °C | Documented product range |
| Coefficient of thermal expansion | 63 | × 10-6/°C | TMA; temperature region and cure condition not stated |
| Thermal conductivity | 7 | W/(m·K) | Test method, temperature, specimen geometry, and cure condition not stated |
| Volume resistivity at 25°C | 0.0002 | ohm-cm | Test method, specimen geometry, and cure condition not stated |
| Tensile lap shear strength — aluminum to aluminum | 20 | psi | Substrate preparation, bondline, cure condition, test method, and test temperature not stated |
