FREKOTE 770-NC

Harmonization Code : 3403.19 | Lubricating Preparations (With 70% or More Petroleum Oils) For Automotive and Other Uses

FREKOTE 770-NC

Main features

  • High-Cycle Semiconductor Mold Release
  • Low-Residue Mold Release
  • Epoxy-Molding-Compound Temperature Compatibility

Product Description

LOCTITE® FREKOTE® 770-NC is a silicone-based mold release agent formulated to provide consistent release and reduced mold maintenance for semiconductor transfer, compression, and injection molds. It offers reliable demolding performance while minimizing residue and contamination risks in epoxy molding compound processes.

Key features

  • Consistent Release: Supports repeated press cycles with minimal sticking.
  • Low Residue: Helps maintain mold cleanliness and reduces downtime.
  • Temperature Compatibility: Effective across typical semiconductor molding temperature ranges.

Applications / Suitable for

  • Semiconductor transfer and compression molds
  • Epoxy molding compound processing
  • High-cycle production molding evaluation
LOCTITE® FREKOTE® 770-NC mold release agent

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Product Family

FREKOTE 770-NC

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Clear Liquid
Specific GravitySpecific Gravity
0.715
Thermal Properties
Temperature ResistanceTemperature Resistance
400 ˚C

Additional Information

Semiconductor Mold Maintenance

LOCTITE® FREKOTE® 770-NC

Silicone-based mold release agent providing reliable demolding performance, low residue, and minimal maintenance for high-cycle semiconductor molding applications.

Consistent Release Low Residue Temperature Range
LOCTITE® FREKOTE® 770-NC mold release agent

Representative product image

Semiconductor Mold Maintenance

LOCTITE® FREKOTE® 770-NC

Silicone-based mold release agent providing reliable demolding performance, low residue, and minimal maintenance for high-cycle semiconductor molding applications.

Consistent Release Low Residue Temperature Range
LOCTITE® FREKOTE® 770-NC mold release agent

Representative product image

Processing

Stage 1 - Application: Apply uniformly on clean mold surfaces using brush or spray.
Stage 2 - Drying: Allow coating to flash-off at ambient temperature for 10–15 minutes.
Stage 3 - Mold Use: Operate mold normally; reapply as needed based on cycle performance.
Processing visual for LOCTITE® FREKOTE® 770-NC

Processing illustration — replace with final CMS visual

Storage and Handling

Store in tightly closed containers at ambient temperature. Protect from heat, sparks, and direct sunlight. Use standard PPE during handling.

Technical Guidance

Issue: Sticking during first cycles
Ensure mold surface is completely clean before initial application; flash-off time must be observed.
Issue: Excess residue buildup
Perform routine mold cleaning cycles; reapply FREKOTE 770-NC as needed based on observed release performance.
Semiconductor transfer mold

Semiconductor Transfer Molds

Provides reliable release and minimal residue in epoxy molding compound processes.

Compression molding

Compression Molding

Supports repeated press cycles with consistent release and low maintenance.

Injection molding

Injection Molding

Minimizes sticking and facilitates smooth part demolding in high-volume operations.

Need Technical Support?

Contact Krayden for guidance on FREKOTE 770-NC selection, mold compatibility, processing assistance, or to discuss performance optimization for your semiconductor molding applications.

Contact Krayden

Leading Brands Trust in Our Products and Services

  • Jabil
  • Linxens
  • Magna
  • Medtronic
  • NXP
  • Philips
  • Semikron
  • Teledyne
  • Thales
  • Vishay
  • ZF
  • AMS
  • Apple
  • Audi
  • Broadcom
  • Borgwarner
  • Bosch
  • Eaton
  • Henkel
  • Honeywell
  • Hysol
  • Intel
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