FREKOTE RC-321 | Krayden

Main features

Consistent Multi-Cycle Mold Release
Reduced Resin Adhesion to Mold Surfaces
Semi-Permanent Low-Residue Coating

Product Description

LOCTITE® FREKOTE® RC-321 is a high-performance, semi-permanent mold-release coating for semiconductor molds. It provides consistent release, protects mold surfaces from resin adhesion, and minimizes flash and sticking during high-volume transfer, compression, and injection molding operations.

Key features

Consistent release: Maintains multiple molding cycles without reapplication under recommended conditions.
Mold surface protection: Reduces resin build-up and preserves tool integrity during high-temperature molding.
Semi-permanent coating: Balances long-term mold protection with easy maintenance and limited residue.

Applications / Suitable for

Semiconductor transfer molding of encapsulated packages
Compression molding of epoxy-molded devices
Injection molding for high-density leadframe packages

LOCTITE® FREKOTE® RC-321 product container

LOCTITE® FREKOTE® RC-321 container

TDS, SDS & Technical Documents

Technical Specifications

General Properties

Color

Translucent white emulsion

Specific Gravity

0.98

Thermal Properties

Temperature Resistance

315 ˚C

Additional Information

Semiconductor Mold Maintenance

LOCTITE® FREKOTE® RC-321

Semi-permanent mold-release coating for semiconductor molds providing consistent release, mold protection, and minimized flash during transfer, compression, and injection molding.

Consistent release Mold protection Semi-permanent

LOCTITE® FREKOTE® RC-321 container

Appearance

Clear amber film

Dry semi-permanent coating

Form

Liquid / Sprayable

Ready for application

Shelf Life

24 months

Original container, stored at recommended conditions

Processing Summary

Surface preparation: Clean mold surface of cured resin and debris prior to coating.

Application: Apply thin uniform coat by spraying or brushing; allow flash-off before molding.

Post-application: Inspect film uniformity; reapply thin layers as needed for extended cycles.

Release Performance

Multiple molding cycles

Maintains release up to 175°C

Residue

Minimal

Reduces package contamination risk

Technical Guidance

Flash or sticking

Ensure mold is clean, apply thin uniform coat, allow proper flash-off.

Reduced release

Reapply a thin layer as per recommended production intervals.

Applications

Transfer molding

Encapsulated semiconductor packages with consistent release.

Compression molding

Epoxy-molded devices maintaining surface integrity.

Injection molding

High-density leadframe packages with minimized flash.

Product Resources

FREKOTE Mold Release Solutions Guide

Comprehensive brochure detailing FREKOTE products, mold-release solutions, and application guidance.

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Need Technical Assistance?

Contact Krayden’s technical experts for guidance on mold-release application, process optimization, and product evaluation for LOCTITE® FREKOTE® RC-321.

Contact Krayden