LOCTITE UK3364

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

LOCTITE UK3364

Main features

  • 60-120 Second Gel Time
  • 1:2 Volume Mix Ratio
  • Rigid Fiber-Optic Encapsulation

Product Description

LOCTITE UK 3364 Fiber-Optic Potting and Bonding Compound is a rigid, two-part urethane compound for potting and bonding fiber-optic components and cables. The dark-brown resin and black hardener mix at 1:2 by volume or 42:100 by weight and cure rapidly at room temperature. Typical gel time is 60 to 120 seconds at 25 deg C, with a tack-free surface in 330 to 360 seconds. After cure, the black material provides Shore D hardness of at least 80, 26.7 N/mm^2 tensile strength, and 32 kV/mm dielectric breakdown strength for mechanically rigid, electrically insulating fiber-optic assemblies.

Key features

  • Fast Room-Temperature Cure: Provides a 60 to 120 second gel time and 330 to 360 second tack-free time at 25 deg C.
  • Fiber-Optic Potting and Bonding: Supports rigid encapsulation and attachment of fiber-optic components and cables.
  • Rigid Flame-Resistant Urethane: Cures to a black solid with Shore D hardness of at least 80.

Applications

Applications include potting and bonding fiber-optic components, cable assemblies, and related electrically insulating structures.

Technical Specifications

Physical Properties
Tack-Free TimeTack-Free Time
5 to 6 minutes
Viscosity (Part A)Viscosity (Part A)
13,365 mPa.s
Viscosity (Part B)Viscosity (Part B)
850 mPa.s
Young's modulusYoung's modulus
2320 MPa
General Properties
AppearanceAppearance
Black
Chemistry TypeChemistry Type
Polyisocyanate
Mix RatioMix Ratio
42 : 100
Specific GravitySpecific Gravity
1.31
Mechanical Properties
ElongationElongation
1.7 %
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
50 °C
Thermal ConductivityThermal Conductivity
0.43 W/m.K
Electrical Properties
Dielectric StrengthDielectric Strength
32 kV/mm
Volume ResistivityVolume Resistivity
2.3×10^15 Ohms⋅cm
Chemical Properties
Water AbsorptionWater Absorption
0.52 %

Additional Information

Technical properties

Component properties

Resin and hardener properties are listed separately before mixing.

Property Value Unit Method / condition
Resin appearance Dark-brown liquid As supplied
Resin specific gravity 1.49 25 deg C
Resin viscosity 13,365 mPa s 25 deg C, CP50 rheometer, shear rate 100
Hardener appearance Black liquid As supplied
Hardener specific gravity 1.25 25 deg C
Hardener viscosity 850 mPa s 25 deg C, CP50 rheometer, shear rate 100
Mix ratio 1:2 by volume Resin : hardener
Mix ratio 42:100 by weight Resin : hardener
Technical properties

Cured potting and bonding properties

Cured properties depend on the specified mix ratio, cure schedule, specimen, and test method.

Property Value Unit Method / condition
Gel time 60 to 120 s 25 deg C
Tack-free time 330 to 360 s 25 deg C
Hardness >=80 Shore D After 60 minutes at 65 deg C
Glass transition temperature 50 deg C After 7 days at 22 deg C
Tensile strength 26.7 N/mm^2 After 7 days at 22 deg C
Dielectric breakdown strength 32 kV/mm After 7 days at 22 deg C
Lap shear strength on grit-blasted steel 19.3 N/mm^2 ISO 4587, 0.127 mm gap, cured 7 days at 22 deg C

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