LOCTITE 3563
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Rapid Heat Cure
- Fast Flow Capillary Action
- Low Moisture Uptake
Product Description
LOCTITE® 3563™ is a one-component, heat-curing epoxy underfill specifically engineered for flip-chip, CSP and BGA electronic packaging applications. The fast-flowing formulation is designed to penetrate extremely small gaps through capillary action, providing efficient underfill coverage beneath surface-mounted devices. Once cured, the material minimizes stress on solder joints, significantly improving thermal cycling reliability and overall assembly durability. Its high filler content, low moisture absorption, excellent electrical insulation properties and high glass transition temperature make it ideal for demanding electronic assembly environments requiring long-term performance and protection.
Key Features & Benefits
- One-component epoxy underfill requiring no mixing
- Rapid heat-curing formulation for high-volume production.
- Fast-flow capillary underfill designed for gaps as small as 25 μm.
- Improves solder-joint reliability during thermal cycling.
- Low moisture uptake and low volatile content
- High electrical insulation and dielectric performance.
- Suitable for CSP, BGA and flip-chip packaging applications.
Recommended Applications
- Capillary-flow underfill for flip-chip devices.
- Ball Grid Array (BGA) package reinforcement.
- Chip Scale Package (CSP) underfill applications.
- Surface-mount device (SMD) attachment to printed circuit boards.
- Electronic assemblies requiring enhanced thermal-cycle reliability.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Chemical Properties
Mechanical Properties
Additional Information
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Epoxy | — | One-component underfill |
| Appearance | Off-White to Beige Liquid | — | Uncured |
| Specific Gravity | 1.52 | — | 25°C |
| Viscosity | 5,000 - 12,000 | mPa·s | 25°C, 5-20 s⁻¹ shear rate |
| VOC Content | <10 | g/L | ASTM D3960 |
| Moisture Content | 0.01 | % | ASTM D4017 |
| Filler Content | 40 | % | Typical |
| Pot Life | 8 - 12 | hours | 22°C |
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) | 130 | °C | DMTA |
| Coefficient of Thermal Expansion (Below Tg) | 35 × 10⁻⁶ | K⁻¹ | ISO 11359-2 |
| Coefficient of Thermal Expansion (Above Tg) | 110 × 10⁻⁶ | K⁻¹ | ISO 11359-2 |
| Thermal Conductivity | 0.38 | W/m·K | ASTM F433 |
| Shore Hardness | 88 | Shore D | ISO 868 |
| Tensile Strength | 69 | N/mm² | ISO 527-3 |
| Tensile Modulus | 2,800 | N/mm² | ISO 527-3 |
| Volume Resistivity | 1 × 10¹⁵ | Ω·cm | IEC 60093 |
| Dielectric Breakdown Strength | 33.5 | kV/mm | IEC 60243-1 |
