BERGQUIST SIL PAD TSP 1600S
Harmonization Code : 8547.90.00.00 | Insulating fittings for electrical machines, appliances or equipment, being fittings wholly of insulating material apart from any minor components of metal (for example, threaded sockets) incorporated during moulding solely for purposes of assembly, other than insulators of heading 8546; electrical conduit tubing and joints therefor, of base metal
Main features
- 0.61 deg C in^2/W Thermal Impedance
- Electrical-Insulation Thermal Interface
- Compliant Fiberglass-Reinforced Low-Pressure Thermal Pad
Product Description
BERGQUIST® SIL PAD® TSP 1600S is a fiberglass-reinforced, silicone-based thermal interface pad developed for electrically insulating heat transfer in low-pressure clamping applications. The pink, 0.229 mm thick material combines a smooth, compliant surface with a thermal conductivity of 1.6 W/m·K and a thermal impedance of 0.61 °C·in²/W at 50 psi, measured using ASTM D5470. It supports an operating temperature range of -60 to 180 °C and is available in sheet, roll, and die-cut formats, with or without pressure-sensitive adhesive.
Key features
- Low-pressure thermal performance: Provides a typical thermal impedance of 0.61 °C·in²/W at 50 psi using ASTM D5470.
- Electrical insulation: Delivers a typical dielectric breakdown voltage of 5,500 Vac using ASTM D149.
- Flexible supply formats: Available as sheets, rolls, and die-cut parts, with or without pressure-sensitive adhesive.
Applications / Suitable for
- Power supplies
- Automotive electronics
- Motor controls
- Power semiconductors
- Discrete semiconductors mounted with spring clips under low clamping force
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Mechanical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical construction and physical properties of the preformed thermal interface material before installation.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Silicone | — | Preformed thermal interface pad |
| Appearance | Pink | — | Solid film |
| Reinforcement carrier | Fiberglass | — | Product construction |
| Total thickness | 0.229 | mm | ASTM D374 |
| Density / relative density | 1.5 | — | At 25 °C |
| Shore hardness | 92 | Shore A | ASTM D2240 |
| Tensile strength | 9 | MPa | ASTM D412 |
| Elongation | 20 | % | ASTM D412; 45° to warp and fill |
After-processing / final-state properties
Typical thermal and electrical properties of the installed pad. Thermal impedance and TO-220 performance depend on applied pressure and surface conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.6 | W/(m·K) | ASTM D5470 |
| Thermal impedance | 0.61 | °C·in²/W | ASTM D5470 at 50 psi; value includes interfacial thermal resistance |
| TO-220 thermal performance | 2.9 | °C/W | At 50 psi |
| Dielectric breakdown voltage | 5,500 | Vac | ASTM D149 |
| Dielectric constant | 6.0 | — | ASTM D150 at 1,000 Hz |
| Volume resistivity | 1 × 1010 | Ω·m | ASTM D257 |
| Operating temperature range | -60 to 180 | °C | Retention of individual thermal, mechanical, and electrical properties across the full range is not stated |
| Flammability rating | V-0 | — | UL 94 |
