ABLESTIK ECF 563
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 0.004 ohm-cm Volume Resistivity
- Unsupported 2 to 6 MIL Film
- NASA Outgassing Results of 0.21% TML
Product Description
LOCTITE® ABLESTIK ECF 563 is an unsupported, silver-filled epoxy adhesive film for electrically and thermally conductive assembly applications. The gray film is supplied in thicknesses from 2 to 6 mils and supports thin, uniform bondline control with low squeeze-out during bonding. It is intended for microwave and heat-sink applications where electrical insulation is not required, including bonding heat-generating devices to heat sinks and providing RF/EMI shielding when bonding microwave substrates into packages. Guideline cure schedules are 30 minutes at 150°C or 2 hours at 125°C under continuous pressure.
Key features
- Electrical and thermal conduction: Typical cured properties include volume resistivity of 0.004 ohm-cm and thermal conductivity of 1.0 BTU/ft·hr·°F at 121°C.
- Controlled film bondline: Unsupported film construction in 2 to 6 mil thicknesses supports thin, uniform bondlines with low squeeze-out.
- Documented low-outgassing performance: Typical NASA outgassing results are 0.21% TML, 0.02% CVCM, and 0.09% WVR.
Applications / Suitable for
- Bonding heat-generating devices to heat sinks where electrical insulation is not required
- Microwave assembly applications
- RF/EMI shielding when bonding microwave substrates into packages
- Assembly using sheet stock, slit rolls, or die-cut preforms
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical construction, storage, handling, and cure information for the adhesive film before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy film | — | Unsupported adhesive film |
| Appearance | Gray film | — | As supplied |
| Filler type | Silver | — | Conductive filler |
| Film thickness | 2–6 | mil | As supplied |
| Work life | 91 | days | At 25°C |
| Shelf life | 183 | days | At 5°C |
| Cure schedule | 30 minutes or 2 hours | — | 30 minutes at 150°C or 2 hours at 125°C; maintain 2–10 psi pressure during cure |
After-processing / final-state properties
Typical cured-film properties, bonded-joint performance, and outgassing results. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass-transition temperature | 88 | °C | TMA; cure condition not stated |
| Coefficient of thermal expansion — below Tg | 60 | ppm/°C | TMA; cure condition not stated |
| Coefficient of thermal expansion — above Tg | 250 | ppm/°C | TMA; cure condition not stated |
| Thermal conductivity | 1.0 | BTU/ft·hr·°F | At 121°C; method, thickness, and orientation not stated |
| Weight loss | 0.03 | % | At 300°C; method and exposure duration not stated |
| Volume resistivity | 0.004 | ohm-cm | Test method, geometry, and cure condition not stated |
| Electrical resistance through gold joints | 0.001 | ohm/0.5 in² | Measured through gold joints |
| Lap shear strength — aluminum to aluminum | 17 (2,500) | N/mm² (psi) | Tested at 25°C; aluminum surface condition and cure condition not stated |
| Lap shear strength — gold to gold | 20 (3,000) | N/mm² (psi) | Tested at 25°C; surface preparation and cure condition not stated |
| Total mass loss | 0.21 | % | TML, NASA outgassing |
| Collected volatile condensable material | 0.02 | % | CVCM, NASA outgassing |
| Water-vapor regained | 0.09 | % | WVR, NASA outgassing |
