LOCTITE ECCOBOND UF 3811
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Reworkable
- Room temperature flow
- Low viscosity
Product Description
LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.
LOCTITE® ECCOBOND UF 3811 has a high Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing. It is a reworkable underfill with good thermal cycling reliability that cures quickly at moderate temperatures to minimize stress to other components.
Cure Schedule
- 60 minutes @ 100°C
- 30 minutes @ 110°C
- 10 minutes @ 130°C
- 7 minutes @ 150°C
ECCOBOND UF3811
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