ABLESTIK 2907 | Krayden

Main features

Electrically Conductive Bonding
Room-Temperature Adhesive Cure
Glass-to-Plastic Epoxy Bonding

Product Description

LOCTITE® ABLESTIK 2907 is a silver-filled, two-component epoxy adhesive for electronic bonding, sealing, assembly, and repair applications requiring electrical conductivity with supporting mechanical properties. The material cures at room temperature or with heat and is supplied as a solvent-free system with medium viscosity and thixotropic flow behavior. It is used for electrical modules, printed circuitry, wave guides, flat cables, and high-frequency shields, and may be considered for heat-sensitive assemblies where hot soldering is impractical.

Key features

Silver-filled epoxy adhesive with electrical and thermal conductivity
Two-component system for mixed adhesive application
Room-temperature or heat-cure processing flexibility
Medium mixed viscosity of 6,500 mPa·s with thixotropic index of 3.5
Typical volume resistivity as low as 3×10-4 ohm-cm after 10 minutes at 100°C
Suitable for bonding dissimilar substrates including metals, ceramics, glass, and plastic laminates

Applications

Applications include electrical modules, printed circuitry, wave guides, flat cables, high-frequency shields, electronic bonding, sealing, assembly, and repair.

TDS, SDS & Technical Documents

Technical Specifications

Physical Properties

Thixotropic index

3.5

Thermal Properties

Glass Transition Temperature (Tg)

50 °C

Electrical Properties

Volume Resistivity

3E-04 Ohms⋅cm

Additional Information

Electrically Conductive Epoxy Adhesive

LOCTITE® ABLESTIK 2907

A two-component, silver-filled epoxy for electronic bonding, sealing, assembly, and repair. The solvent-free adhesive combines electrical and thermal conductivity with room-temperature or heat-cure processing and can be considered as a cold-solder alternative for heat-sensitive components.

Silver-filled epoxy Two-component Room-temperature or heat cure Solvent-free

LOCTITE ABLESTIK 2907 two-component silver-filled conductive epoxy adhesive packaging

LOCTITE ABLESTIK 2907 conductive epoxy adhesive.

Uncured material properties

Mixed viscosity

6,500 mPa·s

Typical value measured with CP #52 at 10 rpm.

Pot life

100 minutes

Typical working time after the two components are mixed.

Property	Typical value	Unit	Method / condition
Appearance	Silver	—	As supplied
Filler type	Silver	—	Product composition
Mixed viscosity	6,500	mPa·s (cP)	CP #52, 10 rpm
Thixotropic index	3.5	—	1 rpm / 10 rpm
Pot life	100	minutes	Mixed material

Application process

Processing and cure

Prepare clean, dry bonding surfaces, mix the two components until the color is uniform, apply the mixed adhesive, bring the parts together under contact pressure, and maintain contact through cure.

Surface preparation: Carefully clean and dry all surfaces before applying the adhesive.

Mixing and application: Mix both components thoroughly until the material is uniform, then apply it to the prepared surfaces.

Recommended cure options: 10 minutes at 100 °C, 2 hours at 65 °C, or 24 hours at 25 °C. Actual cure conditions may require adjustment for the application and equipment.

Precision dispensing of conductive adhesive onto a semiconductor die during electronic assembly, with LOCTITE ABLESTIK 2907 packaging in the background

die attach dispensing process for LOCTITE ABLESTIK 2907 in a semiconductor assembly application

Storage and handling

Store the product unopened in a dry location at the indicated optimal storage temperature of 27 °C. Do not return material removed from a container to the original package. Pre-mixed frozen material should be thawed to room temperature before use.

Typical cured data

Cured properties and performance

Typical values are shown for the stated cure schedules and test conditions and are not product specifications.

Property	Typical value	Unit	Method / condition
Glass transition temperature, ultimate	50	°C	Cured material
Coefficient of thermal expansion	49	ppm/°C	Cured material
Hardness	87	Shore D	10 minutes at 100 °C
Volume resistivity at 25 °C	3 × 10−4	ohm·cm	Sample cured 10 minutes at 100 °C
Volume resistivity at 25 °C	4 × 10−3	ohm·cm	Sample cured 2 hours at 65 °C
Volume resistivity at 25 °C	8 × 10−3	ohm·cm	Sample cured 24 hours at 25 °C
Lap shear strength, aluminum to aluminum	9.0	N/mm²	Cured 10 minutes at 100 °C
Lap shear strength, aluminum to aluminum	10	N/mm²	Cured 2 hours at 65 °C
Lap shear strength, aluminum to aluminum	8.0	N/mm²	Cured 24 hours at 25 °C

Use contexts

Loctite® Ablestik 2907 Application

Electrical module or printed circuit assembly using conductive epoxy for bonding or sealing

Electrical modules and printed circuitry

The conductive epoxy can be used for assembly, bonding, sealing, or repair where the joint must combine mechanical attachment with electrical conductivity.

Waveguide or high-frequency shield assembly with conductive adhesive at the bonded interface

Waveguides and high-frequency shields

Silver filler and low cured volume resistivity make the material relevant to conductive bonding and sealing in waveguide and shielding assemblies.

Heat-sensitive electronic component being bonded or repaired with room-temperature-curing conductive epoxy

Heat-sensitive component assembly and repair

Room-temperature cure enables evaluation as a cold-solder option when conventional hot soldering is impractical for the component or assembly.

Product support

Evaluate LOCTITE ABLESTIK 2907 for your electronic assembly

Contact Krayden to discuss substrate combinations, bonding or sealing requirements, cure-temperature limits, conductive-joint needs, sample requests, and comparison with related electronic assembly or soldering materials.

Discuss Your Application