LOCTITE ECCOBOND 50300-1
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- One component
- Low CTE
- Low viscosity
Product Description
LOCTITE ECCOBOND 50300-1 glob top is designed for encapsulating wire bonded bare die on epoxy laminate and similar substates. The formulation of this single component material ensures a long pot and a very stable viscosity during use.
LOCTITE ECCOBOND 50300-1 is recommended for use on ICs with high wire profiles and in applications where the spreading of the glob top during cure must be controlled. It is a 70% filled product with 100% solids by weight.
Cure Schedule
- 2 hours @ 150°C
Low Stress Cure Schedule
- 1 hour @ 120°C + 1 hour @ 150°C
For best results, substrate should be preheated (up to a maximum of 70ºC) to obtain the optimum flow under and around the wires.
