LOCTITE TC4
Harmonization Code : 3403.19 | Lubricating Preparations (With 70% or More Petroleum Oils) For Automotive and Other Uses
Main features
- Thermally Conductive Lubrication
- High Insulation Resistance
- High Dielectric Strength
Product Description
LOCTITE® TC 4 is a silicone-based thermal grease designed to provide efficient heat transfer between heat-generating electronic components and heat-dissipating structures. The material offers high thermal conductivity, high insulation resistance, and high dielectric strength while maintaining a stable paste-like consistency even after prolonged exposure to elevated temperatures. It is widely used in thermal management applications involving semiconductors, power electronics, thermostats, and heat sinks.
Key Features & Benefits
- High thermal conductivity for efficient heat transfer.
- High insulation resistance.
- High dielectric strength.
- Maintains paste consistency during long-term high-temperature exposure.
- Provides corrosion protection on mating surfaces.
- Suitable for electronic thermal management systems.
- Easy application by brush, syringe, cartridge, or dispensing equipment.
Recommended Applications
- Heat sinks in semiconductor devices.
- Thermoelectric devices and radiators.
- Thermostat mounting surfaces.
- Power resistors mounted on chassis.
- General electronic heat-transfer interfaces.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
AppearanceAppearance
WhiteSpecific GravitySpecific Gravity
2.35Thermal Properties
Thermal ConductivityThermal Conductivity
0.6 W/m.KElectrical Properties
Dielectric StrengthDielectric Strength
19.7 kV/mmAdditional Information
Technical Properties
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Silicone Grease | — | Thermal management compound |
| Appearance | White | — | As supplied |
| Density | 2.35 | g/cm³ | Typical value |
| Shelf Life | 365 | days | 18 to 25°C storage |
| Operating Temperature Range | -40 to +200 | °C | Continuous service |
| Application Type | Thermal Management | — | Heat transfer interface material |
Technical Properties
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Thermal Conductivity | 0.6 | W/(m·K) | Typical cured property |
| Hardness | 20 - 25 | Shore A | Physical property |
| Dielectric Strength | 19.7 | kV/mm | Electrical property |
| Volume Resistivity | 1 × 10¹³ | Ω·cm | Electrical property |
| High Temperature Stability | Excellent | — | Will not harden after prolonged heat exposure |
| Heat Transfer Efficiency | High | — | Electronic thermal interface applications |
| Electrical Insulation | High | — | High insulation resistance and dielectric strength |
