LOCTITE 384
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 0.757 W/(m K) Thermal Conductivity
- Room-Temperature Activator Cure
- Controlled Medium-Strength Bonding
Product Description
LOCTITE® 384 is a one-component, thermally conductive modified acrylic adhesive engineered for bonding heat-generating electronic components to heat sinks and printed circuit board assemblies. This white to off-white paste delivers excellent thermal conductivity for efficient heat dissipation while maintaining controlled bond strength that allows field repair and component replacement when required. Used with an activator, LOCTITE 384 cures rapidly at room temperature and is widely utilized for bonding transformers, transistors and other thermally sensitive electronic components.
Key Features & Benefits
- One-component modified acrylic adhesive requiring no mixing.
- Thermally conductive formulation for effective heat transfer.
- Room-temperature cure when used with activator.
- Controlled bond strength permits servicing and repair.
- Suitable for transformers, transistors and power devices.
- High-viscosity paste minimizes migration after dispensing.
- Provides both thermal management and mechanical attachment.
Recommended Applications
- Bonding heat-generating components to heat sinks.
- Transformer and transistor mounting.
- Electronic assembly thermal management.
- Printed circuit board component attachment.
- Repairable thermal bonding applications.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Electrical Properties
Additional Information
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Modified Acrylic | — | Thermally conductive adhesive |
| Appearance | White to Off-White Paste | — | Uncured |
| Components | One Component | — | No mixing required |
| Specific Gravity | 1.64 | — | 25°C |
| Viscosity (2.5 rpm) | 500,000 - 2,250,000 | mPa·s | Brookfield HBT, 25°C |
| Viscosity (20 rpm) | 300,000 - 800,000 | mPa·s | Brookfield HBT, 25°C |
| Cure System | Activator Cure | — | Room-temperature cure |
| Strength Classification | Medium | — | Controlled strength adhesive |
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Thermal Conductivity | 0.757 | W/m·K | ISO 8302 |
| Coefficient of Thermal Expansion | 69 × 10⁻⁶ | K⁻¹ | ISO 11359-2 |
| Tensile Strength at Break | 13 | N/mm² | ISO 527-3 |
| Elongation at Break | 0.9 | % | ISO 527-3 |
| Young's Modulus | 2,800 | N/mm² | ISO 527-3 |
| Volume Resistivity | 1.3 × 10¹² | Ω·cm | IEC 60093 |
| Surface Resistivity | 5.1 × 10¹³ | Ω | IEC 60093 |
| Dielectric Breakdown Strength | 26.7 | kV/mm | IEC 60243-1 |
| Lap Shear Strength (Steel) | ≥5.2 | N/mm² | ISO 4587, 24 h cure @ 22°C |
