ABLESTIK 84-1LMINB
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 0.0001 ohm-cm Volume Resistivity
- Screen-Printable Epoxy Bonding
- 30-Minute Working Window
Product Description
LOCTITE ABLESTIK 84-1LMINB is a silver-filled, electrically conductive, one-component epoxy adhesive designed for semiconductor die attach. The solvent-free material can be applied by automatic dispenser, screen printing, or hand probe and has a typical Brookfield viscosity of 60,000 mPa.s (cP) at 25 degC and 5 rpm. It provides a three-day work life at 25 degC and cures in 30 minutes at 150 degC. The cured adhesive combines low electrical resistivity with documented thermal, mechanical, ionic, and outgassing performance.
Key Features
- Silver-filled electrically conductive epoxy for die attach
- One-component, solvent-free formulation
- Automatic dispense, screen print, or hand-probe application
- Typical viscosity of 60,000 mPa.s (cP) at 25 degC and 5 rpm
- Three-day work life at 25 degC
- Recommended cure of 30 minutes at 150 degC
- Typical volume resistivity of 0.0001 ohm-cm after cure
Applications / Suitable for
- Semiconductor die attach
- Electrically conductive die-to-substrate attachment
- Automatic dispensing and screen-print die attach processes
- Applications requiring a high-purity, silver-filled attach adhesive
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
Electrically Conductive Die Attach Adhesive
LOCTITE ABLESTIK 84-1LMINB
LOCTITE ABLESTIK 84-1LMINB is a silver-filled, one-component epoxy adhesive developed for semiconductor die attach. The solvent-free paste supports automatic dispensing, screen printing, and hand-probe application, with a three-day work life at 25 degC and a recommended 30-minute cure at 150 degC.
As-Supplied Die Attach Paste
As-Supplied Properties
The as-supplied material is a silver, high-purity epoxy paste. Its viscosity and work-life data are important process-selection parameters for dispensing and printing operations.
Brookfield CP51, 25 degC, 5 rpm.
Typical work life at 25 degC.
Electrically conductive filler system.
| Property | Typical value | Condition / context |
|---|---|---|
| Technology | Epoxy | One-component heat-cure system |
| Appearance | Silver | As supplied |
| Viscosity | 60,000 mPa.s (cP) | Brookfield CP51, 25 degC, 5 rpm |
| Work life | 3 days | 25 degC |
| Shelf life | 183 days | -10 degC, from date of manufacture |
| Shelf life | 365 days | -40 degC, from date of manufacture |
Conditioning, Application and Cure
Processing and Cure
Before use, allow the frozen adhesive to reach room temperature while the syringe remains vertical. Do not open the container until the contents reach 25 degC, and remove any moisture from the outside of the thawed container before opening. Once thawed to 25 degC, the adhesive should not be re-frozen.
The supplied TDS includes a syringe-size-dependent thawing graph for 1 cc, 3 cc, 10 cc, and 30 cc packages. Because the graph does not provide a tabulated dataset, exact intermediate thaw-time values are not reconstructed here.
Storage and Handling
Optimal storage is -40 degC in the unopened container and a dry location. The TDS reports 365 days of shelf life at -40 degC and 183 days at -10 degC. Storage above or below the stated optimal -40 degC may adversely affect product properties. Keep the container closed, avoid contamination, and do not return removed material to the original container.
Final Attach Layer
Cured Properties
The cured material combines electrical conductivity, thermal conductivity, controlled thermal expansion, and high-temperature glass-transition behavior. These are typical bulk-material values and should not be converted into package-level thermal or electrical performance without assembly-specific evidence.
Typical cured bulk electrical property.
Typical cured value at 121 degC.
Typical Tg reported in the TDS.
| Property | Typical result | Method / condition |
|---|---|---|
| Coefficient of thermal expansion | 52 ppm/degC | TMA, below Tg |
| Coefficient of thermal expansion | 150 ppm/degC | TMA, above Tg |
| Glass transition temperature | 117 degC | Typical cured value |
| Thermal conductivity | 4.5 W/(m-K) | 121 degC |
| Volume resistivity | 0.0001 ohm-cm | Cured material |
| Chloride extractable ionic content | 80 | Reported TDS value; unit not stated in supplied source |
| Sodium extractable ionic content | 25 | Reported TDS value; unit not stated in supplied source |
| Potassium extractable ionic content | 5 | Reported TDS value; unit not stated in supplied source |
| Water extract conductivity | 15 umhos/cm | Reported TDS value |
| pH | 4.4 | Water extract context |
Die Attach and Environmental Data
Performance Evidence
The manufacturer reports die shear on a defined Au-to-Au specimen and NASA outgassing results. These values are specific to their stated test configurations and should not be generalized to other die sizes, metallizations, package geometries, or qualification conditions.
Die shear strength
10 kg-f/die
2 x 2 mm (80 x 80 mil) Au-to-Au specimen, tested at 25 degC.
NASA TML
0.9%
Typical total mass loss reported under NASA outgassing testing.
NASA CVCM
0.02%
Typical collected volatile condensable material result.
NASA WVR
0.07%
Typical water vapor regained result.
Documented Assembly Role
Applications
Semiconductor Die Attach
Designed specifically for attaching semiconductor die using an electrically conductive cured bondline.
Automated Material Deposition
Supports automatic dispenser and screen-print processes, with hand-probe application also documented.
Conductive Attach Evaluation
The silver-filled formulation supports evaluation where an electrically conductive die attach layer is required. Final suitability remains dependent on die size, metallization, bondline, cure, and package design.
Technical Support for LOCTITE ABLESTIK 84-1LMINB
Discuss frozen-material handling, syringe thawing, dispensing or printing, die placement, cure profiling, bondline control, metallization compatibility, and package-level thermal or electrical evaluation with Krayden. Process trials should confirm performance in the intended die, substrate, finish, geometry, and assembly conditions.
Contact Krayden Technical Support
