LOCTITE E-214HP
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- One-Component Adhesive System
- Heat-Activated Bonding Cure
- Thermal Shock Resistance
Product Description
LOCTITE® EA E-214HP™ is a one-component, heat-curing epoxy adhesive designed for high-strength structural bonding applications. This thixotropic, no-mix formulation develops tough, durable bonds with outstanding peel resistance, impact strength, thermal shock resistance, and excellent electrical and mechanical properties. Once fully cured, it offers broad chemical resistance and bonds effectively to metals, glass, ceramics, and engineering plastics.
Key Features & Benefits
- One-component epoxy requiring no mixing.
- Heat-activated cure for high-performance structural bonding.
- Excellent peel resistance and impact strength.
- Outstanding thermal shock resistance.
- Excellent mechanical and electrical properties.
- Resistant to a wide range of chemicals and solvents.
- Bonds metals, glass, ceramics and plastics.
Recommended Applications
- Structural metal bonding.
- Glass and ceramic assembly.
- Engineering plastic bonding.
- Industrial equipment manufacturing.
- High-temperature structural adhesive applications.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Additional Information
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Epoxy | — | One-component adhesive |
| Appearance | Light Grey Paste | — | As supplied |
| Specific Gravity | 1.11 | — | 25°C |
| Brookfield Viscosity | 2,000,000 - 3,000,000 | mPa·s (cP) | Spindle 7, 1 rpm |
| Brookfield Viscosity | 1,500,000 | mPa·s (cP) | Spindle 7, 2.5 rpm |
| Physical Form | Thixotropic Paste | — | Ready-to-use |
| Storage Temperature | < 4 | °C | Recommended storage |
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Glass Transition Temperature (Tg) | 120 | °C | ISO 11359-2 |
| Shore Hardness | 85 | Shore D | ISO 868 |
| Elongation at Break | 7 | % | ISO 527-2 |
| Tensile Strength | 31 | N/mm² | ISO 527-2 |
| Dielectric Breakdown Strength | 22 | kV/mm | IEC 60243-1 |
| Lap Shear Strength (Steel) | 33 | N/mm² | 2 h @ 120°C + 4 h @ 22°C |
| Lap Shear Strength (Aluminum) | ≥13.8 | N/mm² | Acid etched & abraded |
| Lap Shear Strength (Stainless Steel) | 37 | N/mm² | Structural bond |
| Block Shear Strength (Glass) | 23 | N/mm² | ISO 13445 |
| Recommended Cure Schedule | 2 h @ 120°C | — | 150°C cure maximizes properties |
