ECCOBOND F131

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

ECCOBOND F131

Main features

  • Clear Fiber-Optic Assembly Epoxy
  • Room-Temperature or Accelerated Heat Cure
  • High-Tg Cured Epoxy

Product Description

LOCTITE ECCOBOND F 131 BIPAX is a clear, two-part epoxy adhesive supplied in a BIPAX mixing-dispenser package for opto/photonics bonding. It is intended for terminating fiber optic connectors and assembling LED displays, lenses, and other optical components. The mixed adhesive has a typical viscosity of 1,800 mPa·s at 25°C and a 100:30 resin-to-hardener ratio by weight. It can cure at room temperature or with heat, with guideline schedules ranging from 18 hours at 25°C to 15 minutes at 90°C for one-drop applications. After cure, it has a typical glass transition temperature of 95°C and an operating-temperature range of -60 to 120°C.

Key features

  • Clear opto/photonics epoxy: Developed for fiber optic connectors, LED displays, lenses, and other optical components.
  • Flexible cure scheduling: Supports room-temperature curing or accelerated heat-cure schedules.
  • Cured mechanical performance: Provides a typical 95°C Tg and 25 N/mm² lap shear strength on aluminum-to-aluminum specimens.

Applications / Suitable for

  • Fiber optic connector termination
  • LED display assembly
  • Lens bonding
  • Other optical-component assemblies
Product Family

ECCOBOND F131

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

Physical Properties
Thixotropic indexThixotropic index
1.0
ViscosityViscosity
1800 mPa.s
General Properties
Mix RatioMix Ratio
100:30
Specific GravitySpecific Gravity
1.2
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
95 °C

Additional Information

Technical properties

As-supplied / before-processing properties

Typical values for LOCTITE ECCOBOND F 131 BIPAX. Values are reference data and should not be treated as guaranteed specifications.

Property Value Unit Method / condition
Chemistry Epoxy Two-component resin and hardener system
Color Clear Mixed adhesive
Mix ratio 100:30 By weight Resin to hardener
Mixed viscosity 1,800 mPa·s At 25°C
Specific gravity 1.2 Mixed adhesive
Thixotropic index 1.0 Uncured material
Guideline cure schedules 18 h at 25°C; 1 h at 65°C; 15 min at 90°C The 90°C schedule applies to one-drop applications; actual cure conditions may vary by application and equipment
Technical properties

After-processing / final-state properties

Typical cured-material properties. Mechanical and electrical results apply to the stated test configuration or condition.

Property Value Unit Method / condition
Operating temperature -60 to 120 °C Documented product operating-temperature range
Glass transition temperature 95 °C Typical Tg
Hardness 78 Shore D Cured material
Lap shear strength 25 N/mm² Aluminum-to-aluminum specimens; equivalent reported value 3,700 psi
Izod impact strength 0.22 ft-lb/in of notch Izod impact-strength test
Volume resistivity 1.00 × 1011 ohm·cm At 25°C

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