LOCTITE ABLESTIK ICP 3510
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Component assembly
- Cost effective
- Silver plated Cu filler
Product Description
LOCTITE® ABLESTIK ICP 3510 epoxy adhesive is designed for use in automated assembly and in-line curing operations. This electrically conductive, silver plated copper filled epoxy displays good dispense behavior and can cure fast at high temperatures.
Silver-plated Cu filler makes this material way more cost-effective and less prone to silver price fluctuations while maintaining a great amount of the properties that assembly houses are looking for.
LOCTITE® ABLESTIK ICP 3510 is heat resistant after cure, forms a high-strength bond, and is typically used as a component assembly adhesive that can be used for cameras and sensors.
Cure Schedule
- 1hour @ 100°C
- 45minutes @ 120°C
- 30minutes @ 150°C
Can also cure on a hot plate for 60 seconds maximum @ 180 to 190°C
ABLESTIK ICP3510
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