ABLESTIK 2115

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

ABLESTIK 2115

Main features

  • Shock- and Temperature-Cycling Resistance
  • Low-Viscosity Precision Optic Bonding
  • 60-Watt Laser-Energy Resistance

Product Description

LOCTITE ABLESTIK 2115 BIPAX is a two-component, clear epoxy adhesive formulated for bonding optical components where alignment accuracy is essential. Supplied at a 100:30 resin-to-hardener mix ratio in a BIPAX mixing-dispenser package, it cures at room temperature over 24 hours or faster with an alternative 1-to-2-hour cure at 65°C, and supports continuous service from -70°C to 100°C. The adhesive is used in laser fabrication and other optic applications, is capable of withstanding 30 seconds of 60-watt direct laser energy, and has been used in cycling applications down to 4 K. Cured bonds offer resistance to water, weathering, ozone, most petroleum solvents, mild acids and alkalis, and other chemicals, bonding glass, rigid plastics, ceramic, and metals.

Key features

  • Low viscosity, low shrinkage: 250 cP mixed viscosity supports precise, controlled application in optical assembly.
  • Excellent mechanical shock and temperature cycling resistance: Maintains bond integrity through thermal cycling, including cryogenic use down to 4 K.
  • High shear strength: 3,800 psi lap shear strength on aluminum-to-aluminum bonds.

Applications / Suitable for: Laser fabrication and other optic applications requiring precise alignment, including cryogenic and thermal cycling environments.

Product Family

ABLESTIK 2115

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Clear
Refractive indexRefractive index
1.55
Specific GravitySpecific Gravity
1.22
Physical Properties
Thixotropic indexThixotropic index
1
ViscosityViscosity
250 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
55 °C
Operating TemperatureOperating Temperature
-70 to 100 °C

Additional Information

Optical and Precision Bonding Epoxy Adhesives

LOCTITE ABLESTIK 2115 BIPAX

LOCTITE ABLESTIK 2115 BIPAX is a two-component, clear epoxy adhesive for precision bonding of optical components where alignment accuracy is important. It combines low viscosity and low shrinkage with mechanical shock and temperature-cycling resistance, bonds glass, rigid plastics, ceramic, and metals, and is supplied in BIPAX packaging for controlled mixing.

Two-component epoxyClearLow viscosityLow shrinkage
Technical properties

Typical pre-cure properties

Values below describe the mix ratio or mixed adhesive before cure. Mixed-material values are kept distinct from the separate resin and hardener component states. Values are typical.

LOCTITE ABLESTIK 2115 BIPAX typical pre-cure properties
Property Value Unit Method / condition
Mix ratio, resin : hardener 100 : 30 by weight Mixing ratio
Viscosity, mixed 250 cP At 25 deg C, after mixing
Thixotropic index 1.0 - Mixed material
Specific gravity, mixed 1.22 - Mixed material
Processing

Mixing, application and cure

LOCTITE ABLESTIK 2115 BIPAX is supplied in a mixing-dispenser package. Surface preparation, thorough component mixing, the available working period after mixing, maintaining contact between the bonded surfaces, and selection of the room-temperature or elevated-temperature cure schedule are the principal processing considerations.

Surface preparation: Carefully clean and dry all surfaces before mixing or applying the adhesive.
Mixing and working time: Mix resin and hardener at 100 : 30 by weight. Remove the BIPAX clamp and mix thoroughly until uniform. Typical pot life of the mixed material is 2 hours.
Application and assembly: Apply the mixed adhesive to the prepared surfaces and bring the parts together. Maintain contact between the bonded surfaces until the adhesive is fully cured.
Cure schedule: Cure for 24 hours at 25 deg C or use the alternative elevated-temperature schedule of 1 to 2 hours at 65 deg C.
Storage and handling

Store the product in its unopened container in a dry location at an optimal storage temperature of 27 deg C. If ingredients crystallize during low-temperature storage, warm the material gently at 52 deg C for 30 minutes before mixing. Material removed from the original container should not be returned after use because it may become contaminated.

Final-state properties

Typical cured properties

Values describe the cured adhesive and are typical. Where a specific test method is not available in the supplied information, the method is identified as not stated rather than inferred.

LOCTITE ABLESTIK 2115 BIPAX typical cured properties
Property Value Unit Method / condition
Hardness 78 Shore D Cured material; method not stated
Glass transition temperature (Tg) 55 deg C Cured material; method not stated
Coefficient of thermal expansion 5.50x10^-5 cm/cm/deg C Cured material; method not stated
Refractive index 1.55 - Cured material; method not stated
Izod impact strength 0.22 ft-lb/in. of notch Cured material; method not stated
Volume resistivity 9.00x10^8 ohm cm At 25 deg C; method not stated
Dielectric strength 430 volts/mil Cured material; method not stated
Lap shear strength, Al to Al 3,800 psi Aluminum-to-aluminum bond; method not stated
Applications

Optical bonding applications

Documented use contexts include laser fabrication, precision optical component bonding, and optical assemblies exposed to substantial temperature cycling.

Laser fabrication
The adhesive is used for laser fabrication and is reported to withstand 30 seconds of 60-watt direct laser energy. Its clear epoxy form, low viscosity, and low shrinkage support evaluation for optical bonding where alignment accuracy is important.
Precision optical component bonding
For optical assemblies requiring controlled component positioning, the adhesive bonds glass, rigid plastics, ceramic, and metals. Its low viscosity and low shrinkage are relevant where adhesive placement and alignment stability are important evaluation factors.
Cryogenic and temperature-cycling optical assemblies
The adhesive has been used in cycling applications down to 4 K and is described as resistant to mechanical shock and temperature cycling. These characteristics support evaluation where optical assemblies experience substantial temperature variation.
Next steps

Evaluate LOCTITE ABLESTIK 2115 BIPAX for your optical bonding process

Krayden can help review whether LOCTITE ABLESTIK 2115 BIPAX fits your optical bonding process, including substrate combination, alignment requirements, mixed-material handling, working time, cure schedule, service-temperature considerations, and the relevance of its cured mechanical and electrical properties to your evaluation.

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