LOCTITE ABLESTIK 8322A

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Loctite Ablestik 8302

Main features

  • Minimal resin bleed
  • Large device bonding
  • Accurate bondline control

Product Description

This product has been discontinued since Q4 2021. If you are looking for alternatives you mights be interested in 2200D, QMI536NB or 8303A

LOCTITE® ABLESTIK 8322A adhesive is designed for medium die attach applications. Improvements in epoxy resin and adhesion technology were incorporated into this adhesive for maintaining significant bond strength after exposure to elevated temperatures and humidity.

LOCTITE® ABLESTIK 8322A is a snap curable epoxy with minimal resin bleed and low condensable volatiles. It is suitable for large device bonding with great resistance to delamination with excellent dispensability that is engineered for accurate bondline control.

Cure Schedule

  • Please consult the TDS for the Snap cure schedule.(60sec)
  • 30 minutes @ 175°C
Product Family

ABLESTIK 8322A

No longer available

This product is no longer available from Krayden. Please contact us so we can recommend an alternative product.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
Density (g)Density (g)
2.8 g/cm3
Work life @25°CWork life @25°C
24 hours
Electrical Properties
Volume ResistivityVolume Resistivity
2.4 Ohms⋅cm
Chemical Properties
Moisture absorptionMoisture absorption
0.75 %
Physical Properties
Thixotropic indexThixotropic index
4
ViscosityViscosity
9,000 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
30 °C
Specific Heat CapacitySpecific Heat Capacity
1.3 J/(g⋅°C)
Thermal ConductivityThermal Conductivity
0.7 W/m.K

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