LOCTITE D124F-1
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- One-Component Adhesive System
- High Dot Profile
- No-Stringing Bonding Application
Product Description
LOCTITE® D 124F-1 RED is a one-component epoxy adhesive specifically formulated for bonding surface mounted devices (SMDs) to printed circuit boards prior to wave soldering. The material offers high dot profile, fast heat cure, excellent green strength, high thixotropy and resistance to wave soldering processes. Its fluorescent red color allows easy inspection under black light, making it suitable for automated electronics assembly operations.
Key Features & Benefits
- One-component epoxy adhesive system.
- High dot profile with no stringing during dispensing.
- Fast cure and low-temperature cure capability.
- Improved green strength for handling before soldering.
- High thixotropy for controlled adhesive placement.
- Resistant to wave soldering operations.
- Fluorescent under black light for inspection.
Recommended Applications
- Surface mounted device (SMD) bonding.
- Printed circuit board assembly.
- High-profile MELF component attachment.
- Flat chip component bonding.
- Wave soldering assembly processes.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
AppearanceAppearance
Red pasteDensity (g)Density (g)
1.2 g/cm3Physical Properties
Thixotropic indexThixotropic index
3.8Additional Information
Technical Properties
As-Supplied / Before-Processing Properties
| Property | Value | Unit | Condition |
|---|---|---|---|
| Technology | Epoxy | — | One-component adhesive |
| Appearance | Red Paste | — | As supplied |
| Density | 1.2 | g/cm³ | Uncured material |
| Brookfield Viscosity | 220,000 | mPa·s (cP) | TD spindle, 10 rpm |
| Thixotropic Index | 3.8 | — | Typical value |
| Shelf Life | 91 | days | Stored at 4°C |
| Application Method | Dispense / Stencil / Pin Transfer | — | PCB assembly |
Technical Properties
After-Processing / Final-State Properties
| Property | Value | Unit | Condition / Method |
|---|---|---|---|
| Recommended Cure Schedule | 15 | minutes | 100°C |
| Alternative Cure Schedule | 5 | minutes | 120°C |
| Fast Cure Schedule | 2.5 | minutes | 150°C |
| Operating Temperature Range | -40 to +105 | °C | Service temperature |
| Dielectric Strength | 14.8 | kV/mm | Cured material |
| Dielectric Constant | 3.0 | — | 1 MHz |
| Volume Resistivity | 1 × 10¹³ | Ω·cm | 25°C |
| Tensile Lap Shear Strength | 7.6 | N/mm² | Aluminum to Aluminum, 25°C |
