LOCTITE EIF1000
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- Phase-Change Surface Conformability
- Kapton-Based Electrical Isolation
- Residue-Free Pad Replacement
Product Description
LOCTITE EIF 1000 is an amber, electrically isolating phase-change thermal interface film supplied as a dry compound on a Kapton MT substrate. At approximately 60 deg C, the compound becomes thixotropic and conforms to mating surface features, helping expel interface air while the Kapton layer provides electrical isolation. Available as die-cut pads, multi-pad sheets or continuous rolls, the material supports repeatable installation between heat-generating components and heat sinks or chassis. It operates up to 150 deg C and can be removed without leaving foreign residue, allowing a replacement pad to be installed without further cleaning.
Key features
- Phase-change conformability: The compound flows at approximately 60 deg C to conform to interface surfaces.
- Kapton-based isolation: Electrical isolation is provided by the Kapton MT substrate.
- Reworkable pad formats: Die-cut pads, sheets and rolls can be removed without foreign residue.
Applications
Applications include thermal interfaces between non-isolated heat-dissipating components and heat sinks or chassis.
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Thermal Properties
Additional Information
As-supplied properties
Construction, available formats and thickness options before installation.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Amber | As supplied | |
| Construction | Dry phase-change compound on Kapton MT | Electrically isolating substrate | |
| Available formats | Single die-cut pads, multi-pad sheets, continuous rolls | Custom parts also available | |
| KA thickness | 0.051 substrate; 0.076 total | mm | KA construction |
| KB thickness | 0.025 substrate; 0.051 total | mm | KB construction |
| K3 thickness | 0.076 substrate; 0.102 total | mm | K3 construction |
| Phase-change temperature | 60 | deg C | Compound becomes thixotropic above phase change |
| Optimal storage | Below 40 | deg C | Unopened container in a dry location |
Final-state properties
Installed thermal and electrical values; thermal impedance is variant-specific at 80 psi.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| KA thermal impedance | 1.29 | deg C cm^2/W | ASTM D5470 at 80 psi; 0.076 mm total thickness |
| KB thermal impedance | 0.776 | deg C cm^2/W | ASTM D5470 at 80 psi; 0.051 mm total thickness |
| K3 thermal impedance | 1.88 | deg C cm^2/W | ASTM D5470 at 80 psi; 0.102 mm total thickness |
| Thermal conductivity | 0.45 | W/(m K) | Reported for KA, KB and K3 constructions |
| Volume resistivity | 1 x 10^14 | ohm-cm | Kapton MT substrate data |
| Dielectric strength | 4,500 to 5,000 | VAC/mil | ASTM D149-91; Kapton MT substrate data |
| Dielectric constant | 4.2 | Kapton MT substrate data | |
| Cut-through resistance | 18.1 | kg | DuPont test method |
