LOCTITE EA 9396.6MD

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

LOCTITE EA 9396.6MD

Main features

  • Two-Part Potting/Edge-Fill Syntactic Epoxy
  • Controlled Processing Window
  • Elevated-Temperature Mechanical Properties

Product Description

LOCTITE EA 9396.6MD is an easy-mixing, two-part syntactic epoxy adhesive developed for potting and edge-fill applications. It combines a low mixed density of 0.63 g/mL with a 100:31 resin-to-hardener mix ratio by weight and a 120-minute pot life for a 100 g mass at 25 degrees C. The system cures for 5 days at 25 degrees C or 60 minutes at 82 degrees C. Typical cured data include 44.8 MPa ultimate compressive strength at 25 degrees C and 26.9 MPa at 149 degrees C, plus lap shear strength of 18.6 MPa at 25 degrees C and 9.7 MPa at 149 degrees C on prepared 2024-T3 aluminum under the documented test configuration. The documented service temperature is 149 degrees C.

Key features

  • Product form: Two-part syntactic epoxy adhesive that mixes to a light-blue material.
  • Low mixed density: Typical mixed density of 0.63 g/mL.
  • Controlled processing: 100:31 resin-to-hardener mix ratio by weight with a 120-minute pot life for a 100 g mass at 25 degrees C.
  • Cure options: 5 days at 25 degrees C or 60 minutes at 82 degrees C.
  • Elevated-temperature compression: Typical ultimate compression strength of 26.9 MPa at 149 degrees C under the documented ASTM D695 configuration.
  • Documented dielectric behavior: X-band dielectric constant of 2.05 and loss tangent of 0.0239 under ASTM D2520-95 Method A.

Applications / Suitable for

  • Potting applications.
  • Edge-fill applications.
Product Family

LOCTITE EA 9396.6MD

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

No specifications available.

Additional Information

Low-density syntactic epoxy

LOCTITE EA 9396.6MD

LOCTITE EA 9396.6MD is a two-part syntactic epoxy adhesive for potting and edge-fill applications. The light-blue mixed material has a typical density of 0.63 g/mL, a 120-minute pot life for a 100 g mass at 25 degrees C, and ambient or accelerated cure options. Published data show compressive and lap-shear strength retention at 149 degrees C, together with X-band dielectric properties.

Two-part syntactic epoxy Potting and edge fill 100:31 mix ratio by weight 120-minute pot life at 25 degrees C 0.63 g/mL mixed density Ambient or accelerated cure

LOCTITE EA 9396.6MD two-part syntactic epoxy adhesive system.

As-supplied properties

Mix ratio
100:31 by weight
Resin to hardener. Preserve the weight basis for ratio control.
Mixed density
0.63 g/mL
Typical value for the mixed syntactic epoxy.
Pot life
120 minutes
For a 100 g mass at 25 degrees C, tested by ASTM D2471 in a water bath.

Values are source-reported and typical where indicated. Preserve component identity, ratio basis, mixed mass, temperature and test context during process evaluation.

Property Value Unit Method / condition
Product form Two-part syntactic epoxy adhesive N/A Resin and hardener require mixing before application.
Part A appearance Light blue N/A As-supplied resin.
Part B appearance White N/A As-supplied hardener.
Mixed appearance Light blue N/A After complete mixing.
Mix ratio 100:31 By weight Resin to hardener.
Part A density 0.72 Unit not stated The TDS reports the numerical density without an explicit unit.
Part B density 0.5 g/mL As-supplied hardener.
Mixed density 0.63 g/mL Mixed adhesive.
Pot life 120 Minutes 100 g mixed mass at 25 degrees C in a water bath; ASTM D2471.
Processing

Mixing, application, and cure

Control component temperature, the weight ratio, mixed mass, surface preparation, assembly support and cure schedule. Pot life is reported for a 100 g mass, while the supplier separately limits batch size to 450 g because larger masses can generate hazardous exotherm.

Component conditioning: Mix the individual components immediately before use and bring the separate components close to room temperature, approximately 25 degrees C.
Mixing: Combine 100 parts resin with 31 parts hardener by weight and mix thoroughly. Do not mix quantities greater than 450 g; smaller quantities reduce heat buildup.
Application: Use clean, dry and properly prepared surfaces. Hold the parts in contact until the adhesive has set.
Handling and cure: Handling strength develops after 24 hours at 25 degrees C, but only small loads should be applied at that stage. Cure for 5 days at 25 degrees C or 60 minutes at 82 degrees C for normal performance.
Uncured cleanup: Remove excess adhesive before it hardens. The supplier identifies denatured alcohol and many common industrial solvents as suitable for uncured material; follow the solvent supplier's safe-use information.
Storage and handling

Store in unopened containers in a dry location and do not return dispensed material to the original container. The TDS states a 12-month shelf life at or below -18 degrees C in original unopened containers; component data also list Part A at 365 days at 4 degrees C or -18 degrees C, and Part B at 365 days at 4 degrees C or 180 days at or below 28 degrees C. Review the current container label and SDS before handling. Part A is classified for skin and eye irritation and skin sensitization; Part B is classified for severe skin burns and eye damage and skin sensitization. Use adequate ventilation and the protective equipment required for the task.

Cured material properties

Shore hardness
70 Shore D
Cured 5 days at 25 degrees C on an approximately 6.35 mm thick specimen.
Glass transition temperature
64 or 112 degrees C
Dry Tg by E prime: 64 degrees C after 5 days at 25 degrees C and 112 degrees C after 1 hour at 82 degrees C.
Thermal conductivity
0.147 W/mK
ASTM E1461 after curing 5 days at 25 degrees C.
Service temperature
149 degrees C
Defined by the supplier as the temperature at which the adhesive retains 6.9 MPa lap shear strength using ASTM D1002.

These are typical cured-material results under the stated cure, specimen and test conditions. They are not guaranteed design allowables.

Property Value Unit Method / condition
Shore hardness 70 Durometer D Cured 5 days at 25 degrees C; approximately 6.35 mm thick specimen.
Glass transition temperature, dry Tg by E prime 64 degrees C Cured 5 days at 25 degrees C; DMA conditions reported in the TDS footnote.
Glass transition temperature, dry Tg by E prime 112 degrees C Cured 1 hour at 82 degrees C; DMA conditions reported in the TDS footnote.
Coefficient of thermal expansion above Tg 40 ppm ASTM E831-05; cured 5 days at 25 degrees C.
Coefficient of thermal expansion below Tg 78 ppm ASTM E831-05; cured 5 days at 25 degrees C.
Thermal diffusivity 0.0015 cm2/s ASTM E1461; cured 5 days at 25 degrees C.
Specific heat 0.99 J/g ASTM E1461; cured 5 days at 25 degrees C.
Thermal conductivity 0.147 W/mK ASTM E1461; cured 5 days at 25 degrees C.
Tensile strength at 25 degrees C 20.7 MPa ASTM D638; 3.18 mm castings; cured 90 minutes at 82 degrees C.
Tensile modulus at 25 degrees C 2,000 MPa ASTM D638; 3.18 mm castings; cured 90 minutes at 82 degrees C.
Elongation at break 2 to 3 % ASTM D638; 3.18 mm castings; cured 90 minutes at 82 degrees C.

Mechanical and dielectric performance

The supplier reports temperature-dependent compression and lap-shear results plus X-band dielectric data. Each result applies to the documented specimen, cure, substrate and test configuration and should be validated in the intended assembly.

Compressive strength at 25 and 149 degrees C
Typical ultimate compression strength is 44.8 MPa at 25 degrees C and 26.9 MPa at 149 degrees C. The corresponding 2% offset values are 41.4 MPa and 20.7 MPa.
ASTM D695; cylindrical specimens approximately 25.4 mm tall by 12.7 mm diameter; cured 5 days at 25 degrees C.
Lap shear on prepared 2024-T3 aluminum
Typical tensile lap shear strength is 18.6 MPa at 25 degrees C and 9.7 MPa at 149 degrees C.
ASTM D1002; 2024-T3 bare aluminum treated by phosphoric acid anodizing per ASTM D3933; the TDS reports curing for 5 days at 25 degrees C or 60 minutes at 71 degrees C.
X-band dielectric properties
At a test frequency of 9.375 GHz, the reported dielectric constant is 2.05 and the loss tangent is 0.0239.
ASTM D2520-95 Method A; 19.1 mm specimen thickness; wavelength coefficient 0.7428; cured 7 days at 25 degrees C.
Next steps

Evaluate LOCTITE EA 9396.6MD with Krayden

Krayden can help review potting or edge-fill geometry, component and surface preparation, mix and dispense controls, batch size, cure selection, thermal and dielectric requirements, and the relevance of the published mechanical data to your assembly. Contact the team to discuss product selection, samples or a technical evaluation plan.

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