ABLESTIK 568
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 2.5 x 10^14 ohm-cm Volume Resistivity
- 2-Hour 95 deg C Cure
- 3 mil Glass-Fabric-Supported Film
Product Description
LOCTITE® ABLESTIK 568 is a non-conductive epoxy adhesive film designed for substrate-attach applications. The amber film uses a glass-fabric carrier and has a documented thickness of 3 mil. It provides a typical 24-hour work life at 25°C and low-temperature heat-cure options of 2 hours at 95°C or 4 hours at 75°C under continuous pressure. Typical cured properties include thermal conductivity of 0.28 W/(m·K) at 121°C, volume resistivity of 2.5 × 1014 ohm-cm, and dielectric strength of 1,200 V/mil.
Key features
- Electrically insulating film: Typical cured volume resistivity is 2.5 × 1014 ohm-cm, with dielectric strength of 1,200 V/mil.
- Low-temperature heat cure: Guideline cure schedules include 2 hours at 95°C or 4 hours at 75°C.
- Controlled adhesive format: A 3 mil glass-fabric-supported film is available as sheet stock or customer-specific die-cut preforms.
Applications / Suitable for
- Substrate-attach applications
- Electrically insulating adhesive-film bonding
- Assembly processes requiring lower-temperature heat cure
- Sheet-stock or die-cut adhesive preforms
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical construction, handling, storage, and guideline cure information for the adhesive film before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy film | — | Non-conductive adhesive film |
| Appearance | Amber film | — | TDS appearance; SDS describes the -1-003 construction as translucent |
| Carrier type | Glass fabric | — | Adhesive-film construction |
| Adhesive-film thickness | 3 | mil | Documented TDS construction |
| Specific gravity | 1.29 | — | SDS value for LOCTITE ABLESTIK 568-1-003 |
| VOC content | <1 | % | SDS value for LOCTITE ABLESTIK 568-1-003 |
| Work life | 24 | hours | At 25°C |
| Shelf life | 365 | days | At -40°C, from date of manufacture |
| Recommended cure schedule | 2 | hours | At 95°C; guideline recommendation |
| Alternative cure schedule | 4 | hours | At 75°C; guideline recommendation |
| Cure pressure | 5–10 | psi | Continuous pressure during the cure cycle |
After-processing / final-state properties
Typical thermal, electrical, and bonded-joint properties of the cured adhesive film. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 0.28 | W/(m·K) | At 121°C; test method, orientation, and cure condition not stated |
| Volume resistivity | 2.5 × 1014 | ohm-cm | Test method, specimen geometry, and cure condition not stated |
| Dielectric strength | 1,200 | V/mil | Test method, specimen thickness, conditioning, and cure condition not stated |
| Dielectric constant | 4.1 | — | At 1 kHz |
| Dissipation factor | 0.0076 | — | At 1 kHz |
| Lap shear strength — aluminum to aluminum | 35.17 (5,100) | N/mm² (psi) | Tested at 25°C; surface preparation, bondline, cure condition, and test method not stated |
| Lap shear strength — gold to gold | 24.14 (3,500) | N/mm² (psi) | Tested at 25°C; surface preparation, bondline, cure condition, and test method not stated |
