ABLESTIK 83CJ

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ABLESTIK 83CJ

Main features

  • 0.0004 ohm-cm Volume Resistivity
  • 45-Minute Working Window
  • Cold-Solder-Type Electrical Connections

Product Description

LOCTITE ABLESTIK 83CJ is a silver-filled, thixotropic epoxy adhesive for electrically and thermally conductive assembly bonding. It is designed for electrical connections where hot soldering is impractical and for conductive plastics that cannot be exposed to high temperatures. The resin can be used with multiple catalysts, including room-temperature- and heat-cure options documented in the supplied technical data. Typical cured performance includes 2.6 W/(m-K) thermal conductivity and 0.0004 ohm-cm volume resistivity.

Key Features

  • Silver-filled, electrically and thermally conductive epoxy adhesive
  • Thixotropic silver paste for controlled assembly application
  • Supports room-temperature or heat-cure catalyst systems
  • Designed for electrical connections where hot soldering is impractical
  • Documented for metals, glass, ceramics, plastics, and conductive plastics
  • Typical cured thermal conductivity of 2.6 W/(m-K)
  • Typical cured volume resistivity of 0.0004 ohm-cm at 25 degC

Applications / Suitable for

  • Electrically conductive assembly bonding
  • Cold-solder-type electrical connections where hot soldering is impractical
  • Electrical connections to conductive plastics that cannot tolerate high temperatures
  • Bonding metals, glass, ceramics, and plastics where supported by application validation
Product Family

ABLESTIK 83CJ

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Silver paste
Chemistry TypeChemistry Type
Epoxy
Density (g)Density (g)
3.0 g/cm3

Additional Information

Electrically Conductive Assembly Adhesive

LOCTITE ABLESTIK 83CJ

LOCTITE ABLESTIK 83CJ is a silver-filled, thixotropic epoxy adhesive for conductive assembly bonding. It is designed to make electrical connections where hot soldering is impractical and to connect conductive plastics at locations that cannot be exposed to high temperatures. The resin supports multiple catalyst systems with different cure and work-life characteristics.

Silver-filledElectrically conductiveThermally conductiveThixotropic epoxyMultiple catalyst options
Resin and Catalyst Components

As-Supplied Properties

Typical resin, catalyst, and mixed-material values are listed separately so catalyst-specific processing behavior remains clear.

Property Value Unit Method / condition
ABLESTIK 83CJ resin - Appearance Silver paste - As supplied
ABLESTIK 83CJ resin - Density 3.0 g/cm^3 ASTM D792
ABLESTIK 83CJ resin - Shelf life 183 days 25 deg C, from date of manufacture
CAT 9M - Viscosity 92.5 mPa s (cP) 25 deg C
CAT B97 - Viscosity 6,000 mPa s (cP) 25 deg C
83CJ + CAT 9M - Mixed density 2.95 g/cm^3 100 g, 25 deg C
83CJ + CAT 9M - Work life 45 min 100 g, 25 deg C
83CJ + CAT B97 - Mixed density 2.27 g/cm^3 100 g, 25 deg C
83CJ + CAT B97 - Work life 24 h 100 g, 25 deg C
Catalyst Selection and Cure

Catalyst Options and Processing

Clean the substrates, prepare the resin, accurately weigh the selected catalyst, and mix thoroughly before assembly. Catalyst choice changes the mix ratio, work life, and cure schedule, while post-cure may be used when optimum performance is required.

Surface preparation: Remove oxide, dust, moisture, salt, oils, and other contamination before bonding.
Resin preparation: Thoroughly mix the resin container before use. Accurately weigh resin and catalyst, then blend for 2 to 3 minutes using a kneading motion while scraping the sides and bottom.
CAT 9 / CAT 9M: Mix ratio 100 : 3.5 by weight; work life 45 min for 100 g at 25 deg C; cure 60 min at 65 deg C or 30 min at 100 deg C.
CAT B97: Mix ratio 100 : 1.0 by weight; work life 24 h for 100 g at 25 deg C; cure 2 h at 100 deg C or 30 min at 125 deg C.
Post-cure and assembly: For optimum performance, follow the initial cure with a 2 to 4 hour post-cure at the highest expected use temperature. In most applications only contact pressure is required.
Storage and Handling

Store LOCTITE ABLESTIK 83CJ in the unopened container in a dry location at 25 deg C. The resin has a typical shelf life of 183 days at 25 deg C from the date of manufacture. Do not return removed material to the original container because it may introduce contamination.

Catalyst-Dependent Final Properties

Cured Properties

Typical cured values are listed by catalyst system so catalyst-specific operating-temperature and lap-shear results remain distinct.

Property Value Unit Method / condition
CTE - 83CJ + CAT 9M 45 ppm/deg C TMA
CTE - 83CJ + CAT B97 45 ppm/deg C TMA
Operating-temperature range - 83CJ + CAT 9M -40 to +130 deg C Catalyst-specific
Operating-temperature range - 83CJ + CAT B97 -55 to +155 deg C Catalyst-specific
Thermal conductivity - 83CJ + CAT 9M 2.6 W/(m K) Typical cured bulk value
Thermal conductivity - 83CJ + CAT B97 2.6 W/(m K) Typical cured bulk value
Volume resistivity - 83CJ + CAT 9M 0.0004 ohm-cm 25 deg C
Volume resistivity - 83CJ + CAT B97 0.0004 ohm-cm 25 deg C
Al-to-Al tensile lap shear - 83CJ + CAT 9M 6.8 N/mm^2 (1,000 psi) 25 deg C
Al-to-Al tensile lap shear - 83CJ + CAT B97 9.6 N/mm^2 (1,400 psi) 25 deg C
NASA TML / CVCM - 83CJ + CAT 9M 0.64 / 0.02 % / % NASA RP 1124; sample cured 1 h at 66 deg C
NASA TML / CVCM - 83CJ + CAT B97 Not reported - -
Documented Assembly Uses

Applications

Applications include cold-solder-type electrical connections, conductive plastics, and assemblies involving metals, glass, ceramics, and plastics.

Cold-Solder-Type Connections
Designed to make electrical connections where conventional hot soldering is impractical.
Conductive Plastics
Supports electrical connection to conductive plastics at locations that cannot be subjected to high temperatures.
Multi-Substrate Assembly
Documented substrate classes include metals, glass, ceramics, and plastics. Final performance depends on substrate grade, preparation, catalyst, cure, and joint design.
Next steps

Technical Support for LOCTITE ABLESTIK 83CJ

Krayden can help review catalyst selection, mix ratio, working time, cure profile, substrate preparation, and electrical or thermal requirements for LOCTITE ABLESTIK 83CJ. Application trials should confirm the selected catalyst system and bonded-joint performance for the intended substrates, geometry, temperature range, and manufacturing process.

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