ABLESTIK CF3366
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 0.0003 ohm-cm Volume Resistivity
- 5.17 N/mm^2 Aluminum Lap Shear
- Flexible Cured Adhesive
Product Description
LOCTITE® ABLESTIK CF 3366 is a silver-filled epoxy film adhesive formulated for electrical, thermal, and mechanical assembly applications. The gray-tan film has a documented thickness of 102 µm and is suitable for bonding copper, brass, Kovar, and aluminum in fluoropolymer circuits, ceramic circuits, metal backplanes, and heat-sink assemblies. It combines electrical and thermal conductivity with flexible adhesion, uniform bondline control, and low-temperature heat-cure options. Guideline cure schedules are 60 minutes at 150°C or 120 minutes at 125°C under 10 to 60 psi pressure.
Key features
- High electrical conductivity: Typical cured volume resistivity is 0.0003 ohm-cm at 25°C.
- Elevated-temperature adhesion: Aluminum-to-aluminum tensile lap shear strength is reported as 12 N/mm² at 25°C and 5.17 N/mm² at 150°C.
- Controlled film bonding: The 102 µm film supports uniform bondline adhesion, flexible bonding, and customer-specific preforms.
Applications / Suitable for
- Fluoropolymer circuits
- Ceramic circuits
- Metal backplanes
- Heat-sink assemblies
- RF ground-plane bonding
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical construction, work-life, storage, and cure information for the adhesive film before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy film | — | Conductive adhesive film |
| Appearance | Gray tan film | — | As supplied |
| Filler type | Silver | — | Conductive filler |
| Film thickness | 102 | µm | As supplied |
| Work life | 91 | days | At 25°C |
| Shelf life | 183 | days | At 5°C, from date of manufacture |
| Peak exotherm temperature | 165 ± 5 | °C | DSC, ramp rate 10°C/minute |
| Cure schedule | 60 minutes or 120 minutes | — | 60 minutes at 150°C or 120 minutes at 125°C; specified temperatures and times refer to bondline values |
| Cure pressure | 10–60 | psi | May vary with bonded materials and assembly size |
After-processing / final-state properties
Typical cured-film properties and bonded-joint performance. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass-transition temperature | 190 | °C | DMA; cure condition not stated |
| Coefficient of thermal expansion — below Tg | 85 | ppm/°C | TMA; cure condition not stated |
| Coefficient of thermal expansion — above Tg | 195 | ppm/°C | TMA; cure condition not stated |
| Storage modulus at 25°C | 4,500 (652,669) | N/mm² (psi) | DMA |
| Storage modulus at 100°C | 2,500 (362,594) | N/mm² (psi) | DMA |
| Storage modulus at 150°C | 900 (130,534) | N/mm² (psi) | DMA |
| Volume resistivity at 25°C | 0.0003 | ohm-cm | Test method, geometry, and cure condition not stated |
| Tensile lap shear strength — aluminum to aluminum | 12 (1,750) | N/mm² (psi) | Tested at 25°C; surface preparation and cure condition not stated |
| Tensile lap shear strength — aluminum to aluminum | 5.17 (750) | N/mm² (psi) | Tested at 150°C; surface preparation and cure condition not stated |
