ABLESTIK ECF 550
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Conductive Grounding and RF-Shielding Film
- Controlled Film Processing with Flexible Supply Formats
- 20 N/mm^2 Lap Shear
Product Description
LOCTITE ABLESTIK ECF 550 is a gray, silver-filled epoxy film adhesive for electrically conductive microelectronic assembly. The glass-fabric-supported film is designed for gold and other difficult-to-bond metals and can provide an electrical ground-plane function in substrate attach or maintain electrical continuity in RF-shielded package joints. It offers a six-month work life at 25 degC and heat-cure schedules of 30 minutes at 150 degC or 2 hours at 125 degC.
Key features
- Electrically conductive film: Silver-filled epoxy film designed for conductive microelectronic assembly and RF-shielding continuity.
- Controlled film construction: Glass-fabric carrier with a documented 1 mil carrier film thickness.
- Production-friendly formats: Available as sheet stock, slit rolls, or die-cut preforms, with custom die cutting supported.
Applications / Suitable for
- Microelectronic substrate attach requiring electrical conductivity
- Electrical ground-plane bonding
- Assembly and sealing of microelectronic packages requiring RF shielding
- Gold and other difficult-to-bond metal surfaces
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Additional Information
LOCTITE ABLESTIK ECF 550
A silver-filled, glass-fabric-supported epoxy film adhesive for microelectronic assemblies requiring electrical conductivity. In substrate attach it can act as an electrical ground plane, while in RF-shielded package assembly it is designed to maintain electrical continuity between joints. The film is heat cured and is documented for gold and other difficult-to-bond metals.
As-Supplied Properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy film | As supplied | |
| Appearance | Gray | TDS family-level appearance | |
| Filler type | Silver | Electrically conductive filler | |
| Carrier type | Glass fabric | Supported film construction | |
| Carrier film thickness | 1 | mil | Supplier-listed carrier thickness |
| Work life | 6 | months | 25 deg C |
| Shelf life | 9 | months | 5 deg C |
| Shelf life | 1 | year | -40 deg C |
| Relative density | 3.3 | ECF 550-1-006 SDS, solid film | |
| VOC content | < 1 | wt.% | ECF 550-1-006 SDS |
Processing and Cure
Allow the container to reach room temperature before use and do not open it until the contents reach 25 deg C. Remove any moisture collected on the thawed container before opening. Once thawed, the adhesive should not be re-frozen. Place the precut film between clean bonding surfaces, assemble the components, apply continuous pressure, and cure in a preheated oven.
Cure profiles are guideline recommendations and may vary with application requirements, cure equipment, oven loading, and actual oven temperature.
The TDS identifies -40 deg C as the optimal storage temperature and documents a one-year shelf life at -40 deg C or nine months at 5 deg C. The current U.S. SDS for ECF 550-1-006 specifies safe storage at or below 5 deg C. Store unopened material in a dry location, keep the package closed until ready for use, and do not return removed material to the original container.
Cured Properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass transition temperature | 101 | deg C | TDS family-level value |
| Coefficient of thermal expansion, below Tg | 64 | ppm/deg C | TMA |
| Coefficient of thermal expansion, above Tg | 402 | ppm/deg C | TMA |
| Thermal conductivity | 1.0 | W/(m K) | 121 deg C |
| Weight loss | 0.2 | % | 300 deg C |
| Electrical resistance through gold joints | 0.001 | ohm/0.5 sq. in. | Measured through gold joints |
| Al-to-Al lap shear strength | 20 | N/mm^2 | 25 deg C; 3,000 psi |
| Au-to-Au lap shear strength | 24 | N/mm^2 | 25 deg C; 3,500 psi |
Formats and Converting
LOCTITE ABLESTIK ECF 550 is available in sheet stock, slit rolls, and die-cut preforms. The supplier also documents custom die cutting for application-specific dimensions.
Applications
The film is intended for microelectronic assemblies in which adhesive attachment and electrical continuity are both functional requirements. Application statements are limited to the supplier-documented package and substrate roles.
Evaluate LOCTITE ABLESTIK ECF 550 for Your Conductive Film Assembly
Krayden can support evaluation of film format, storage and thawing, substrate preparation, cure pressure, thermal and electrical requirements, gold-interface performance, RF-shielding continuity, and custom converting. Application trials should confirm performance for the intended package, joint geometry, surface finish, cure, and service conditions.
