ECCOBOND F113
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Low-Viscosity Precision Application
- Optically Clear Material
- High Surface Wettability
Product Description
LOCTITE ECCOBOND F 113 is a two-part, optically clear epoxy adhesive for bonding and small-volume potting of optical assemblies. The 100:30 resin-to-hardener system has a mixed viscosity of 180 cP at 25 °C, providing low-viscosity flow and excellent wettability around plastic or glass optical fibers, lenses, prisms and LED displays. The cured adhesive has a refractive index of 1.55 and 97% spectral transmittance from 3,200 to 9,000 Å. It can be cured for 24 hours at 25 °C or accelerated for 1 to 2 hours at 65 °C, with a documented operating temperature range of -60 to 100 °C. It bonds glass, glass fibers, ceramics, many metals and most rigid plastics.
Key features
- Optically clear: Provides 97% spectral transmittance from 3,200 to 9,000 Å and a refractive index of 1.55.
- Low mixed viscosity: A typical viscosity of 180 cP at 25 °C supports wetting and small-volume optical-component potting.
- Wide operating range: Suitable for operating temperatures from -60 to 100 °C.
Applications / Suitable for
- Plastic and glass optical fiber bonding
- Lens and prism bonding
- LED display assembly
- Small-volume potting of optical components
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
General Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
Typical uncured, mixed-material and cure values provided for product evaluation. These values are not guaranteed specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Clear | — | Epoxy adhesive system |
| Mix ratio | 100:30 | Parts by weight | Resin:hardener |
| Mixed viscosity | 180 | cP | At 25 °C |
| Thixotropic index | 1.0 | — | Uncured material |
| Specific gravity | 1.22 | — | Uncured material |
| Pot life | 2 | h | Mixed adhesive |
| Work life | 3 | h | Mixed adhesive |
| Cure schedule | 24 / 1–2 | h | At 25 °C / 65 °C; guideline cure profiles |
After-processing / final-state properties
Typical cured-material properties and laboratory performance values. Test conditions are retained where supplied; values are not guaranteed specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature | -60 to 100 | °C | Documented operating range |
| Coefficient of thermal expansion | 55 | ppm/°C | Cured material |
| Glass-transition temperature | 45 | °C | DMA |
| Refractive index | 1.55 | — | Cured material |
| Spectral transmittance | 97 | % | From 3,200 to 9,000 Å |
| Dielectric strength | 430 | V/mil | Cured material |
| Volume resistivity | 9 × 108 | Ω·cm | At 25 °C |
| Lap-shear strength | 4,000 | psi | Aluminum/aluminum; cured for 2 h at 65 °C |
