LOCTITE 363
Harmonization Code : 3909.20.00.90 | Amino-resins, phenolic resins and polyurethanes, in primary forms : Melamine resins : Other
Main features
- Low-Viscosity Shallow Potting
- Rapid 365 nm UV Cure
- Dielectric Electronic Encapsulation
Product Description
LOCTITE AA 363 is a one-component, low-viscosity urethane methacrylate material for UV-light shallow potting and thin-film encapsulation. The transparent yellow liquid requires no mixing and flows into electronic assemblies that need photocured protection. Typical cure is 20 to 30 seconds at 100 mW/cm^2 with a 365 nm medium-pressure mercury lamp, with a 25-second tack-free time at the same wavelength and intensity. After cure, the material reaches Shore D 50 and has a dielectric breakdown strength of 34 kV/mm. Its function is limited to shallow electronic potting and thin protective encapsulation layers.
Key features
- Low-Viscosity Encapsulation: A 100 to 400 mPa s viscosity supports shallow potting and thin-film coverage.
- Rapid UV Cure: Typical cure is 20 to 30 seconds at 100 mW/cm^2 and 365 nm.
- Electrical Insulation: The cured material provides 34 kV/mm dielectric breakdown strength under the listed test method.
Applications / Suitable for
- Shallow potting of electronic assemblies
- Thin-film encapsulation of electronic assemblies
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Electrical Properties
Physical Properties
Curing Conditions
Additional Information
As-supplied / before-processing properties
Typical values for the uncured or as-supplied product unless otherwise noted.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Transparent yellow | - | Uncured |
| Specific gravity | 1.1 | - | 25 deg C |
| Viscosity | 100 to 400 | mPa s | Brookfield RVT, spindle 1, 20 rpm, 25 deg C |
After-processing / final-state properties
Typical values for the cured product under the listed methods and conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Coefficient of thermal expansion | 100 x 10^-6 | K^-1 | ISO 11359-2; cured material |
| Thermal conductivity | 0.1 | W/(m K) | ISO 8302; cured material |
| Shore hardness | 50 | Durometer D | ISO 868; cured material |
| UV depth of cure | >=1.8 | mm | 100 mW/cm^2 at 365 nm for 20 seconds |
| Dielectric breakdown strength | 34 | kV/mm | IEC 60243-1; cured material |
| Volume resistivity | 2 x 10^15 | ohm cm | IEC 60093; cured material |
| Tensile strength | 3 to 12 | N/mm^2 | ISO 6922; steel pin to glass; cured 20 seconds at 100 mW/cm^2 and 365 nm |
