ABLESTIK 293-1
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- Difficult-Substrate General Assembly Bonding
- 37.9 N/mm^2 Aluminum Lap Shear
- 3.20 x 10^14 ohm-cm Volume Resistivity
Product Description
LOCTITE® ABLESTIK 293-1 is a black, heat-cured epoxy adhesive developed for general assembly bonding. It is documented for bonding difficult-to-bond substrates and for use on gold, nickel, silver, and copper surfaces. The adhesive provides an eight-hour work life and multiple guideline cure schedules ranging from 24 hours at 60°C to 45 minutes at 120°C. Typical cured properties include thermal conductivity of 0.3 W/(m·K) at 121°C, volume resistivity of 3.20 × 1014 ohm-cm at 25°C, and aluminum-to-aluminum lap shear strength of 37.9 N/mm².
Key features
- Strong assembly bonding: Typical aluminum-to-aluminum lap shear strength is 37.9 N/mm².
- Electrical insulation: Typical cured volume resistivity is 3.20 × 1014 ohm-cm at 25°C, with dielectric strength of 900 V/mil.
- Flexible heat-cure options: Guideline schedules range from 24 hours at 60°C to 45 minutes at 120°C.
Applications / Suitable for
- General assembly bonding
- Bonding difficult-to-bond substrates
- Bonding gold, nickel, silver, and copper surfaces
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Typical appearance, handling, storage, and guideline cure information before final processing.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Epoxy | — | Heat-cured assembly adhesive |
| Appearance | Black paste / liquid | — | TDS appearance and SDS physical-state description |
| Density / relative density | 1.2 | — | SDS physical-property value |
| VOC content | 7 | g/L | SDS value |
| Work life | 8 | hours | Temperature and endpoint not stated |
| Shelf life — premixed frozen | 365 | days | At -40°C |
| Recommended cure schedule | 24 | hours | At 60°C; guideline recommendation |
| Alternative cure schedules | 4 hours, 90 minutes, or 45 minutes | — | 4 hours at 75°C, 90 minutes at 95°C, or 45 minutes at 120°C; guideline recommendations |
After-processing / final-state properties
Typical cured physical, thermal, electrical, and bonded-joint properties. Values are reference data and are not product specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 85 | Shore D | Cure condition and test method not stated |
| Glass-transition temperature | 98.0 | °C | Method and cure condition not stated |
| Coefficient of thermal expansion — below Tg | 75.0 | ppm/°C | Test method and cure condition not stated |
| Coefficient of thermal expansion — above Tg | 150 | ppm/°C | Test method and cure condition not stated |
| Thermal conductivity | 0.3 | W/(m·K) | At 121°C; test method, specimen geometry, and cure condition not stated |
| Volume resistivity | 3.20 × 1014 | ohm-cm | At 25°C; test method, specimen geometry, and cure condition not stated |
| Dielectric strength | 900 | V/mil | Test method, thickness, conditioning, and cure condition not stated |
| Dielectric constant | 4.0 | — | At 1 kHz |
| Dissipation factor | 0.015 | — | At 1 kHz |
| Lap shear strength — aluminum to aluminum | 37.9 (5,500) | N/mm² (psi) | Surface preparation, test temperature, bondline, cure condition, and test method not stated |
| Lap shear strength — gold to gold | 27.6 (4,000) | N/mm² (psi) | Surface preparation, test temperature, bondline, cure condition, and test method not stated |
| Lap shear strength — brass to brass | 27.6 (4,000) | N/mm² (psi) | Surface preparation, test temperature, bondline, cure condition, and test method not stated |
| Lap shear strength — silver to silver | 26.2 (3,800) | N/mm² (psi) | Surface preparation, test temperature, bondline, cure condition, and test method not stated |
