LOCTITE ECCOBOND FP0087
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High Tg
- Excellent moisture resistance
- Excellent thermal shock resistance
Product Description
LOCTITE ECCOBOND FP0087 is a single component, epoxy based encapsulant for potting stress-sensitive devices. It yields best results when used to encapsulate a device enclosed in a cavity or potting ring, which restricts the flow of the material. This material is a great encapsulant for potting stress-sensitive devices.
LOCTITE ECCOBOND FP0087 is a single component potting product with low thermal expansion. This product therefore provides excellent thermal shock resistance and reduced warpage and cracking. The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.
Cure Schedule
- 1 hour @ 125°C plus 1 hour @ 180°C
ECCOBOND FP0087
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