LOCTITE ECCOBOND UF 1175
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- White
- Low CTE
- Easy dispensability
Product Description
LOCTITE ECCOBOND UF 1175 partial, white epoxy underfill is formulated for use on large chip sizes, providing good UPH and reliability. Typically used as an electronics encapsulant and a circuit board underfill
LOCTITE ECCOBOND UF 1175 is a fast cure, monocomponent underfill with controlled flow. It offers low CTE and can be dispensed easily and without stringing.
Cure Schedule
- 15 minutes @ 120°C
ECCOBOND UF1175
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Product availability 
Shipping in 64 days
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Shipping in 64 days Shipping in 12 weeks Shipping in 60 daysTechnical Specifications
General Properties
Specific GravitySpecific Gravity
1.65Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
154 °CPhysical Properties
Thixotropic indexThixotropic index
1.05ViscosityViscosity
35,295 mPa.s
