ABLESTIK 3119
Harmonization Code : 38159000 | Unspecified reaction initiators, accelerators, and catalytic preparations
Main features
- Low-Temperature Heat Cure
- No-Mix Electronics Assembly
- Extended Three-Week Pot Life
Product Description
LOCTITE ABLESTIK 3119 is a one-part black epoxy adhesive for bonding heat-sensitive electronic components. It cures at relatively low bondline temperatures, with recommended schedules of 60 minutes at 100 deg C or 120 minutes at 75 deg C. The no-mix format and three-week pot life at 25 deg C simplify material preparation while supporting extended use after temperature conditioning. The specified yield point and Casson viscosity define its high-viscosity dispensing profile for controlled placement. After a 60-minute cure at 100 deg C, the material develops a Shore D hardness of 87, a glass transition temperature of 110 deg C, and electrically insulating cured properties.
Key features
- Low-temperature heat cure: Recommended 75 deg C and 100 deg C bondline schedules support heat-sensitive assemblies.
- One-part no-mix format: Eliminates resin-to-hardener proportioning before dispensing and component placement.
- Extended material window: A three-week pot life at 25 deg C supports planned production use after conditioning.
Applications
Applications include bonding and assembling heat-sensitive electronic components with a low-temperature heat-cure process.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Thermal Properties
Chemical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Rheology values are controlled ranges; cure schedules refer to bondline temperature.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Specific gravity | 1.1 to 1.3 | 25 deg C | |
| Yield point | 10,000 to 38,000 | mPa s | Cone-and-plate rheometer at 25 deg C |
| Casson viscosity | 7,000 to 23,000 | mPa s | Cone-and-plate rheometer at 25 deg C |
| Pot life | 3 | weeks | 25 deg C |
| Recommended cure | 60 min at 100 deg C or 120 min at 75 deg C | Bondline temperature |
After-processing / final-state properties
All final-state values use a 60-minute cure at 100 deg C unless the method states otherwise.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Shore D hardness | 87 | ISO 868; cured 60 min at 100 deg C | |
| Glass transition temperature | 110 | deg C | DMA, ASTM E1640; cured 60 min at 100 deg C |
| Water absorption | 0.36 | % | ISO 62; 24 h in water at 23 deg C; cured 60 min at 100 deg C |
| Volume resistivity | 3.6 x 10^16 | ohm cm | IEC 60093; cured 60 min at 100 deg C |
| Steel lap shear strength | 24 | N/mm^2 | ISO 4587; grit-blasted steel; cured 60 min at 100 deg C |
| Epoxy-glass lap shear strength | >=10 | N/mm^2 | ISO 4587; 1.6 mm substrate; cured 60 min at 100 deg C |
