Additives

Performance Enhancing Additives

Additives

Additives are specialty chemicals that are added to base-chemistries to improve performance. These additives are often blended into the epoxy molding compounds, silicones, epoxy coating powders and other polymers to improve some aspect of performance. KRAYDEN offers a range of specialty additives to be used in our own chemistries or they can be used to improve the performance of your own materials.

76 products

  • INSULCURE 11B

    INSULCURE 11B

    • Heat-Curing INSULCAST Epoxy Curing Agent
    • 700 cP Application Viscosity
    • 3-Hour 100 deg C Cure
  • COOLTHERM SC-6730

    COOLTHERM SC-6730

    • Room-Temperature Thick-Section Cure
    • 3.0 to 10.0% Mix Concentration
    • Blue-Green Visual Mix Indicator
  • LORD 3135-B

    LORD 3135-B

    • Former Lord 7111-B Hardener
    • Low-Shrinkage Epoxy Bonding
    • Room-Temperature or Accelerated Heat Curing
  • DOWSIL 3-6559

    DOWSIL 3-6559

    • Adjustable 1 to 5 Wt% Addition Level
    • 4 to 12-Hour Cure Window
    • Surface/Environment Cure-Inhibition Management
  • BONDERITE C-IC DEOXIDOZER

    BONDERITE C-IC DEOXIDOZER

    • Aluminum Deoxidizing, Desmutting, Etching
    • Prepares for Chromating
    • 1 to 10 Minute Application Rate
  • MM220 | mono-acrylate monomer

    MM220 | Mono-acrylate monomer

    • Low Viscosity
    • Low weight loss on cure
    • Minimizes cure shrinkage
  • LOCTITE UK3184

    LOCTITE UK3184

    • UK 3173 System Hardener
    • 45-Minute System Work Time
    • 24-Hour Room-Temperature Cure
  • A1050 | Anti bleed Additive

    A1050 | Anti bleed Additive

    • Silver filled systems
    • 100 mPa-s Viscosity
    • Non halogenated
  • DOWSIL FS1265

    DOWSIL FS1265

    • 100% Active Fluorosilicone Foam Control
    • Chlorinated-Solvent-Insoluble Foam-Control Formulation
    • 300/1,000/10,000 mm^2/s Viscosity Grades
  • ENTHONE 20/A

    ENTHONE 20/A

    • Two-Hour Mixed-Ink Pot Life
    • Ambient or Heat Cure
    • Permanent Marking Application Flexibility
  • ENTHONE 45

    ENTHONE 45

    • M- and 50-Series Compatibility
    • Catalyst-Selected Cure Control
    • Permanent Marking System Integration
  • ENTHONE 77

    ENTHONE 77

    • Ambient or Heat-Cure Choice
    • One-Hour Ink Pot Life
    • Heat-Enhanced Adhesion Development
  • ENTHONE AD2003

    ENTHONE AD2003

    • Extended Marking-Ink Open Time
    • Incremental 3 to 6% Addition
    • In-Process Machine-Marking Adjustment
  • DOWSIL Q2-1346

    DOWSIL Q2-1346

    • Low Sodium and Potassium Impurity Limits
    • Clear Liquid Supplied Free from Suspended Matter
    • Long 900-Day Shelf Life
  • ENTHONE AD3002

    ENTHONE AD3002

    • Two to Four Percent Flow Adjustment
    • Crawling and Pinholing Control
    • Gentle Post-Induction Mixing
  • ENTHONE B13/28

    ENTHONE B13/28

    • Accelerated Three-Day Ambient Cure
    • One-Hour Processing Window
    • Nonconductive Black Ink Compatibility
  • ENTHONE B3

    ENTHONE B3

    • Four-Hour Ink Pot Life
    • Controlled Heat-Cure Processing
    • Faster Cure at Higher Temperature
  • A6165 | Electrical conductivity Enhancer

    A6165 | Electrical conductivity Enhancer

    • Improves electrical conductivity
    • Soluble in most resin systems
    • May improve thermal conductivity
  • BONDRITE C-AK MIL-ETCH

    BONDRITE C-AK MIL-ETCH

    • Fine Satin or Frosted Etch on Aluminum
    • Low-Foam Alkaline Formulation
    • Scale- and Sludge-Reducing Sequestering Chemistry
  • CS-783 | Methacrylated Epoxy Functional Hybrid Cyclosiloxane

    CS-783 | Methacrylated Epoxy Functional Hybrid Cyclosiloxane

    • Low viscosity
    • Dual cure mechanism
    • Multifunctional
  • BONDERITE C-AD 4215
  • U-847 | Dimer Diisocyanate Urethane Dimethacrylate

    U-847 | Dimer Diisocyanate Urethane Dimethacrylate

    • Low color
    • Low cure shrinkage
    • BPA-free
  • DOW XR-1541

    DOW XR-1541

    • E-Beam Patternable, Negative Tone
    • Etch Resistance Surface Treatment
    • High Purity Surface Treatment
  • BONDERITE C-AK 4316

    BONDERITE C-AK 4316

    • Heat-Scale Conditioning for Multiple Alloys
    • Lower-Temperature Molten-Salt Bath Processing
    • Nonflammable Titration-Controlled Bath Maintenance
  • LOCTITE CAT 14

    LOCTITE CAT 14

    • Powdered Anhydride Epoxy Hardener
    • Long Epoxy Working Life
    • 3-Hour Cure at 150 deg C
  • PEM-665 | Methacrylate terminated polyester

    PEM-665 | Methacrylate terminated polyester

    • Low color
    • Low shrinkage
    • Thermal stability
  • LOCTITE CAT 15

    LOCTITE CAT 15

    • Liquid Polyamide Epoxy Hardener
    • Two-Hour Pot Life
    • 80 deg C Accelerated Cure
  • LOCTITE CAT 15-LV

    LOCTITE CAT 15 LV

    • Low-Viscosity Epoxy Hardener
    • 120-Minute Working Time
    • Rigid/Semi-Rigid/Flexible Epoxy Systems
  • LOCTITE CAT 17M-1

    LOCTITE CAT 17M-1

    • Anhydride-Based Epoxy Hardener
    • Non-Flammable Curing Agent
    • Electronic/Industrial Resin Systems
  • LOCTITE CAT 21

    LOCTITE CAT 21

    • Low-Viscosity Polyoxyalkylene Amine Curative
    • One-Hour Pot Life
    • Large-Mass Epoxy Castings
  • LOCTITE CAT 23LV

    LOCTITE CAT 23LV

    • Low-Viscosity Polyamine Epoxy Catalyst
    • Water-Soluble Curing Agent
    • Low-VOC Amber Liquid
  • LOCTITE CAT 24LV

    LOCTITE CAT 24LV

    • Low-Viscosity Epoxy Curing Agent
    • Long Epoxy Pot Life
    • Low-Temperature Cured Epoxy Performance
  • LOCTITE CAT 27-1

    LOCTITE CAT 27-1

    • Low-CTE Cured Epoxy
    • Two-Hour Working Time
    • Chemical-Resistant Cured Epoxy
  • LOCTITE CAT 43

    LOCTITE CAT 43

    • Liquid Polyamine Epoxy Catalyst
    • Chemical-Resistant Cured Systems
    • LOCTITE Encapsulant Compatibility
  • LOCTITE CAT 50-2

    LOCTITE CAT 50-2

    • Low-Viscosity Liquid Catalyst
    • Dibutyltin Dilaurate Chemistry
    • Consistent Catalytic Activity
  • LOCTITE CAT B97

    LOCTITE CAT B97

    • Low/Medium-Viscosity Epoxy Catalyst
    • Encapsulation and Potting Systems
    • Adhesion and Electrical Insulation
  • LOCTITE CAT9

    LOCTITE CAT9

    • Modified Aliphatic Amine Hardener
    • Chemical-Resistant Cured Epoxy
    • -40 to 130 deg C Service
  • CONAP DS-1832

    CONAP DS-1832

    • Black Epoxy/Polyurethane Color Concentrate
    • 18% Heat-Stable Black Pigment
    • Filled/Unfilled Resin Addition Ranges
  • CONAP DS-1833

    CONAP DS-1833

    • Blue Epoxy/Polyurethane Color Concentrate
    • 50% Heat-Stable Blue Pigment
    • Filled/Unfilled Resin Addition Ranges
  • Benzimidazole CAS #51-17-2

    Benzimidazole CAS #51-17-2

    • Enhanced Thermal Stability
    • Versatile Chemical Base
    • Corrosion Protection
  • BONDERITE M-ED 1000

    BONDERITE M-ED 1000

    • Nickel Acetate-Based Sealing Process
    • Reduced Smut, Powdering, and Yellowing
    • Commercial and Selected Military Anodizing Seal Processes
  • BONDERITE L-AD 42

    BONDERITE L-AD 42

    • Organosilicone Surfactant Foam Control
    • Free-Rinsing Low-Residue Chemistry
    • Polymer, Adhesive, and Latex Foam Control
  • BONDERITE S-AD 103

    BONDERITE S-AD 103

    • Acid-Bath Corrosion Inhibition
    • Direct Liquid Addition to Acid Baths
    • Industrial Metal-Cleaning Bath Support
  • BOSTIK NSBT-16

    BOSTIK NSBT-16

    • Copper-Graphite Anti-Seize Protection
    • Up to 1800 deg F
    • Brush-Top Assembly Application
  • BOSTIK NSBT-16N

    BOSTIK NSBT-16N

    • Copper-Free High-Temperature Protection
    • Seizure and Galling Control
    • Aggressive-Service Assembly Lubrication
  • EPIBOND 1210

    EPIBOND 1210

    • Low-Outgassing Epoxy Bonding
    • 50 to 75-Minute Working Window
    • Flexible Cured Adhesive
  • BOSTIK NSBT-8N

    BOSTIK NSBT-8N

    • Copper-Free Pure-Nickel Protection
    • Severe-Service Assembly Protection
    • Compact 8 oz Package
  • BOSTIK BOSCODUR

    BOSTIK BOSCODUR

    • Solvent-Resistant Urethane Bonding
    • Effective Cross-Linker for Nitrile
    • 4 to 6-Hour Working Window
  • CONAP DS-1831A

    CONAP DS-1831A

    • 15% Red Pigment Concentrate
    • Epoxy and Polyurethane System Compatibility
    • Filled and Unfilled Formulation Guidance
  • MM304 | Methacrylate adhesion promoter Additive

    MM304 | Methacrylate adhesion promoter Additive

    • Mild pleasant odor
    • Hydrolytic resistance
    • Lower weight loss on cure than IBOMA
  • COOLTHERM EP-6252

    COOLTHERM EP-6252

    • Defined Epoxy Hardener Component
    • Electrical Encapsulation System Use
    • Component-Level Metering Control
  • COOLTHERM 6250

    COOLTHERM 6250

    • 350 cP Low-Viscosity Curing Agent
    • High-Solids Adhesive/Encapsulation Curing Agent
    • Chemical-Resistant Cured Epoxy Systems
  • COOLTHERM 6732

    COOLTHERM 6732

    • Hardener Component Thermal Interface Material
    • 100:0.5 Controlled Mixing
    • Thermally Conductive Thermal Interface
  • COOLTHERM 6733

    COOLTHERM 6733

    • Solvent-Free RTV Silicone Encapsulation
    • Low-Stress No-Exotherm Room-Temperature Cure
    • -60 to 205 deg C Continuous Service
  • ARALDITE TDR 1100-11

    ARALDITE TDR 1100-11

    • Glass, Plastic, and Wood Bonding
    • 2:1 Meter-Mix Processing
    • 90-Minute Working Window
  • HARDENER HW 8680

    HARDENER HW 8680

    • 225% Cured Elongation
    • Polycarbonate, Nylon, and Primed-Metal Bonding
    • 1:1 Mix with 15-Minute Open Time
  • HARDENER HY 5049

    HARDENER HY 5049

    • High-Strength Structural Bonding
    • Documented Water/Ice/Tropical-Climate Resistance
    • Transparent Cured Bondline
  • COOLTHERM EP-6010

    COOLTHERM EP-6010

    • 55 cP Application Viscosity
    • Low-Shrinkage Epoxy Curing Agent
    • Two-Year Shelf Life at 25 deg C
  • LORD 304-2

    LORD 304-2

    • High-Viscosity Placement Control
    • Rubber, Wood, and FRP Bonding
    • Durable Cured Performance with Environmental
  • LORD 306-2

    LORD 306-2

    • 306-1 Epoxy Hardener
    • 1 to 2-Hour Working Time
    • 24 to 48-Hour Room-Temperature Cure
  • A1100 | Anti bleed Additive

    A1100 | Anti bleed Additive

    • 0.5%-1% wt
    • Metal surfaces
    • Excellent bleed control
  • A304 | 4-META adhesion promoter Additive

    A304 | 4-META adhesion promoter Additive

    • Dental Applications
    • Adhesion promoter
    • Methacryloxyethyl trimellitic anhydride
  • A478-M | PMDM-M adhesion promoter Additive

    A478-M | PMDM-M adhesion promoter Additive

    • Dental Applications
    • Adhesion promoter
    • Pyromellitic Dianhydride Dimethacrylate
  • A6225| Anti bleed Additive

    A6225| Anti bleed Additive

    • Universal additive
    • Reduces bleed out on metal surfaces
    • Non halogenated
  • A6280  | Anti bleed Additive

    A6280 | Anti bleed Additive

    • Use in Non-metal-filled systems
    • Excellent bleed control on Gold surfaces
    • Non halogenated
  • A675-100 | PMDGM adhesion promoter Additive

    A675-100 | PMDGM adhesion promoter Additive

    • Versatile
    • Adhesion promoter
    • Pyromellitic Dianhydride Glycerol Dimethacrylate Adduct
  • Triethylenetetramine (TETA) Ethylene Amine

    Chemlinq AL20-2B | Triethylenetetramine (TETA)

    • Epoxy crosslinking hardener
    • Soluble in polar solvents
    • Colorless
  • CS-697 | Polyglycidyl ether cyclosiloxane

    CS-697 | Polyglycidyl Ether Cyclosiloxane

    • Low viscosity
    • Compatible with organic resins
    • For formulating adhesives
  • Pallet Dow Corning Toray SF-8421-EG Fluid

    Dow Corning Toray SF-8421-EG Fluid

    • Epoxy Mold Compound (EMC) additive
    • Formulated for compatibility with EMC
    • Internal release agent for EMC
  • MM-204 Dicyclopentadiene Acrylate High Tg Mono-Functional Acrylate Monomer

    MM-204 High Tg Mono-Functional Acrylate Monomer

    • Hydrolytically resistant
    • Low Viscosity
    • High Glass Transition Temperature (Tg)
    Starts at

    €180.72

  • MM211 | Maleimide adhesion promoter Additive

    MM211 | Maleimide adhesion promoter Additive

    • Adhesion promoter
    • Flexible aliphatic backbone
    • Maleimide and carboxylic groups
  • MM281 | Maleimide adhesion promoter Additive

    MM281 | Maleimide adhesion promoter Additive

    • Adhesion promoter
    • Flexible aliphatic backbone
    • Long Alkyl chain
  • MM290| Acrylate adhesion promoter Additive

    MM290| Acrylate adhesion promoter Additive

    • Mild pleasant odor
    • Hydrolytic resistance
    • Lower weight loss on cure than IBOA
  • PEAM-1044 Low warpage Polyester Acrylate/Methacrylate

    PEAM-1044 Low warpage Polyester Acrylate/Methacrylate

    • Thermally stable
    • Low warpage
    • High adhesion to various substrates
  • PEAM-1769 Difunctional (meth)acrylate

    PEAM-1769 Difunctional (meth)acrylate

    • Ultra low modulus
    • Thermal stability
    • High adhesion to various substrates
    Starts at

    €209.04

  • PEAM-645 High Tg Polyester Acrylate/Methacrylate

    PEAM-645 High Tg Polyester Acrylate/Methacrylate

    • High Tg
    • Low CTE
    • High adhesion to various substrates
    Starts at

    €246.02

Product selector guide

Anti-bleed Additive

 

Product Chemistry/Description Application/Features
A1050 Antibleed Additive | Non halogenated

Superior compatibility with metal filler systems such as silver. Improved bleeding properties: Non-metal filled systems ex. silica
Recommended formulation: 0.5% - 1.0%

A1100 Antibleed Additive | Non halogenated Designed for metal surfaces with more acid functionality.
Improved bleeding properties: Non-metal filled systems ex. silica
Recommended formulation: 0.5% - 1.0%
A6225 Antibleed Additive | Non halogenated Universal additive |
Excellent compatibility: Silver
Improved bleeding properties: Non-metal filled systems ex. silica
It also provide mold release and surface atnti stiction properties.
Recommended formulation: 2% - 4%
A6280 Antibleed Additive | Non halogenated

Excellent compatibility: Gold surfaces

Designed for Non-metal filled systems

Minimal or no affect on the adhesion properties of the formulation.
Recommended formulation: 0.5% - 1.0%
A6165 Electrical Conductivity Enhancer

Use as an additive in combination with metal fillers (e.g. silver or Ag coated Cu) to further
decrease volume resistivity in electrically conductive adhesive compositions.
Recommended formulation: < 1.0%

 

Adhesion Promoter Additive

 

Product Chemistry/Description Application/Features
A304 4-Meta (Methacryloxyethyl trimellitic anhydride) Adhesion Promoter Additive

Reactive Primer specific for dental application

Enhance monomer penetration into dentin pretreated with 10% citric acid and 3% ferric chloride

A478-M PMDM-M (Pyromellitic Dianhydride Dimethacrylate) Adhesion Promoter Additive PMDM-M chemistry is a cheaper option for dental adhesive application
A675-100 PMDGM (Pyromellitic Dianhydride Glycerol Dimethacrylate Adduct) Adhesion Promoter Additive Adhesion enhancement where four methacrylate groups and two carboxylic groups per molecule allow bonding to a variety surfaces.
MM211 Maleimide Adhesion Promoter Additive | Flexible Aliphatic backbone Use as intermediate for the synthesis of ester and amide linked thermoset monomers, as well as maleimide functional resins 
MM281 Maleimide Adhesion Promoter Additive | Flexible Aliphatic backbone | Long Aklyl Chain Main difference from MM211 is the twice as long alkyl chain
MM290 Acrylate Adhesion Promoter Use in UV or peroxide cure formulations and applications that require hydrolytic resistance | Mild odor
MM304 Methacrylate adhesion promoter Additive Use as a reactive diluent monomer for use in UV or peroxide cure formulations.

 

Base Resin

 

Product Chemistry/Description Application/Features
PEAM-1044 Low warpage Polyester Acrylate/Methacrylate High thermal stability and low volatility | Use as a base resin in a formulation or an additive | Exceptionally low warpage with the addition of polybutadiene type resins
PEAM-1769 Difunctional (meth)acrylate Use as a base resin or an additive to reduce stress | Excellent adhesion on most substrates with low stress and low shrinkage due to its high Tg polycyclic repeat units.
PEAM-645 High Tg Polyester Acrylate/Methacrylate Use as a base resin in adhesive applications or coating applications | Exhibits low CTE, high Tg, and high modulus.
PEM-665 Methacrylate terminated polyester  Use as a base resin in dental applications | Good solubility in both aliphatic and aromatic co-monomers.

 

Universal Additive

 

Product Chemistry/Description Application/Features
Benzimidazole Benzimidazole | Latent curing Agent For Epoxy Resins Reacts at elevated temperatures makes it ideal for enhancing the thermal stability and mechanical properties of epoxy mold compounds. 
CHEMLINQ AL20-2B Triethylenetetramine (TETA) | Corrosion Inhibitor | Accelerate Curing Process | Fuel Additive Premier epoxy curing agent that accelerates the curing process and can produce durable coatings in adhesives, composites, and coatings
CS-697 Polyglycidyl Ether Cyclosiloxane For Adhesive formulation base resin with compatibility with most organic resins.
CS-783 Methacrylated, Epoxy-functional Hybrid Cyclosiloxane Monomer Adhesion Enhancer Additive Used primarily as an adhesion promoter for mold compounds, metal surfaces, and polyimides by improving interfacial bonding
Dow Corning Toray SF-8421 EG Fluid | EMC Internal Release Agent Additive Formulated for compatibility with EMC wherein the main purpose is to reduce stress and improve flowability of the mold compound | Excellent compatibility with epoxies and silicones
MM204 High Tg Mono-Functional Acrylate Monomer Use as a reactive diluent for UV or peroxide cured resins, coatings or adhesives |  Improve stereolithographic processes for high-temperature applications.
MM220 Low viscosity mono-acrylate monomer  Use as reactive diluent for UV or peroxide cured resins, coatings and adhesives | Polycyclic ring structure helps minimize shrinkage on cure
U-847 high-purity, methacrylate-modified urethane monomeR Use in advanced light-cure formulations | No BPA backbone

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