COOLTHERM EP-6252

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

COOLTHERM EP-6252

Main features

  • Defined Epoxy Hardener Component
  • Electrical Encapsulation System Use
  • Component-Level Metering Control

Product Description

CoolTherm EP-6252 Hardener is the curing-agent component used with selected CoolTherm and Thermoset epoxy resins in two-component electrical encapsulation and bonding systems. This page represents the hardener only, so mix ratio, cure schedule, and final thermal, electrical, or mechanical properties depend on the paired resin. Component-level appearance, viscosity, specific gravity, storage, and shelf-life data support handling and metering before system mixing. It is relevant where EP-6252 Hardener is required as part of a defined Parker LORD epoxy formulation.

Key features

  • Defined hardener component: The product is the curing-agent side of selected two-component CoolTherm and Thermoset epoxy systems.
  • Electrical encapsulation system use: The component is used in epoxy systems for electrical encapsulation and bonding.
  • Component-level handling profile: Viscosity, specific gravity, storage, and shelf-life data support metering and material handling.
Product Family

COOLTHERM EP-6252

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Amber Liquid
Specific GravitySpecific Gravity
0.99
Physical Properties
ViscosityViscosity
75 mPa.s

Additional Information

Technical properties

As-supplied / before-processing properties

Component-level properties and scope for the hardener-only page. Complete-system values depend on the paired resin.

Property Value Unit Method / condition
Product component Hardener component Paired resin is not included in this record
Component function Epoxy curing agent Part of a two-component system
Compatible system context Selected CoolTherm and Thermoset epoxy resins Use with a defined paired formulation
Primary system functions Electrical encapsulation and bonding Complete-system performance depends on the paired resin

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