PERMABOND ES578

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

PERMABOND ES578

Main features

  • 1.0 W/(m K) Thermal Conductivity
  • Heat-Activated Flow for 5 mm Gaps
  • UL 94 V-0 Classification

Product Description

Permabond® ES578 is a high-performance, single-part epoxy adhesive designed to deliver both exceptional bond strength and very good thermal conductivity. Formulated to flow when heated during the cure cycle, it readily fills gaps and ensures optimal contact area for heat transfer. This combination of structural strength, thermal dissipation, and electrical insulation makes it ideal for specialized applications such as bonding aluminum heat sinks to ceramic headers.

Key features

  • Thermally conductive: Provides a thermal conductivity of 1.0 W/(m.K) to effectively dissipate heat from critical components.
  • Fire retardant: The cured adhesive is specifically engineered to meet the stringent fire retardancy requirements of UL94 V-0.
  • Electrically insulating: Delivers high dielectric strength (40-45 kV/mm), making it safe and effective for electronic assemblies.

Applications / Suitable for

  • Bonding applications requiring heat dissipation, such as heat sinks to ceramic headers
  • Structural bonding of metals, ceramics, and composite materials
  • Electronic enclosures requiring UL94 V-0 fire retardancy compliance
Product Family

PERMABOND ES578

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Black paste
Chemistry TypeChemistry Type
Epoxy
SolidsSolids
100 %
Specific GravitySpecific Gravity
1.6
Physical Properties
ViscosityViscosity
600,000 to 800,000 0 mPa.s
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
105 °C
Thermal ConductivityThermal Conductivity
1 W/m.K
Electrical Properties
Dielectric StrengthDielectric Strength
40-45 kV/mm
Other Properties
Maximum gap fillMaximum gap fill
5 mm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties; these values are not intended for use in preparing specifications.

Property Value Unit Method / condition
Chemical Composition Epoxy Resin - -
Appearance Black - Paste
Viscosity 600,000 to 800,000 cP at 25°C (mPa.s)
Specific Gravity 1.6 - -
Maximum Gap Fill 5 mm (0.2 in)
Flash Point > 100 °C -
Technical properties

After-processing / final-state properties

Typical properties; these values are not intended for use in preparing specifications.

Property Value Unit Method / condition
Flow at High Temperature Flowing - -
Cure Speed < 3 minutes Induction
Cure Speed 75 minutes Oven at 130°C (266°F)
Cure Speed 60 minutes Oven at 150°C (300°F)
Cure Speed 25 minutes Oven at 170°C (338°F)
Shear Strength 27-41 N/mm² Steel (ISO 4587) (4000-6000 psi)
Shear Strength 7-31 N/mm² Aluminium (2500-4500 psi)
Shear Strength 4-27 N/mm² Zinc (2000-4000 psi)
Hardness 80-85 Shore D ISO 868
Dielectric Strength 40-45 kV/mm -
Coefficient of Thermal Expansion 45E-6 mm/mm/°C (below Tg)
Thermal Conductivity 1.0 W/(m.K) -
Glass Transition Temperature (Tg) 105 °C (220°F) DSC

Leading Brands Trust in Our Products and Services

  • Jabil
  • Linxens
  • Magna
  • Medtronic
  • NXP
  • Philips
  • Semikron
  • Teledyne
  • Thales
  • Vishay
  • ZF
  • AMS
  • Apple
  • Audi
  • Broadcom
  • Borgwarner
  • Bosch
  • Eaton
  • Henkel
  • Honeywell
  • Hysol
  • Intel
Products that Perform|Knowledge that Serves|Service that Delivers