PERMABOND ES550

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

PERMABOND ES550

Main features

  • Toughened Structural Bonding
  • High-Viscosity Placement Control
  • No-Mix Bonding Processing

Product Description

Permabond® ES550 is a single-part, heat-curing epoxy paste designed for applications requiring high-performance structural bonds. Formulated to be slump-resistant, it will not flow during the heat-curing process, ensuring precise application. This toughened epoxy delivers exceptional shear, peel, and impact strength, making it highly effective for bonding a wide range of materials, including metals, ferrites, ceramics, and composites.

Key features

  • Toughened for high strength: Delivers outstanding impact resistance, alongside excellent shear and peel strength.
  • Slump-resistant paste: The extremely high viscosity (1,000,000 to 2,000,000 cP) paste formulation ensures the adhesive will not flow during the elevated temperatures required for curing.
  • Single-part convenience: Requires no mixing and cures rapidly with heat, eliminating the risk of mixing errors and improving production efficiency.

Applications / Suitable for

  • Bonding metals, ferrites, ceramics, and composites
  • Applications requiring a non-sagging adhesive during heat cure
  • Structural assemblies subject to high impact and vibration
Product Family

PERMABOND ES550

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Silver-grey
SolidsSolids
100 %
Specific GravitySpecific Gravity
1.5
Physical Properties
ViscosityViscosity
1,000,000 to 2,000,000 mPa.s
Mechanical Properties
ElongationElongation
>3 %
Impact StrengthImpact Strength
25-35 KJ/m² mm
Peel StrengthPeel Strength
43.75 N
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
120 °C
Thermal ConductivityThermal Conductivity
0.55 W/m.K
Other Properties
Maximum gap fillMaximum gap fill
5 mm

Additional Information

Technical properties

As-supplied / before-processing properties

Typical properties; these values are not intended for use in preparing specifications.

Property Value Unit Method / condition
Chemical Composition Epoxy Resin - -
Appearance Silver-grey - Paste
Viscosity 1,000,000 to 2,000,000 cP at 25°C (Helipath, 2rpm) (mPa.s)
Specific Gravity 1.5 - -
Maximum Gap Fill 5 mm (0.2 in)
Flash Point > 100 °C (212°F)
Technical properties

After-processing / final-state properties

Typical properties; these values are not intended for use in preparing specifications.

Property Value Unit Method / condition
Cure Speed < 3 minutes Induction
Cure Speed 75 minutes Oven at 130°C (266°F)
Cure Speed 60 minutes Oven at 150°C (300°F)
Cure Speed 40 minutes Oven at 170°C (338°F)
Shear Strength 27-41 N/mm² Steel (ISO 4587) (4000-6000 psi)
Shear Strength > 14 N/mm² Steel to ferrite (>2000 psi) Substrate failure
Impact Strength 25-35 KJ/m² ASTM D-950
Hardness 80-85 Shore D ISO 868
E-modulus 4.8 GPa -
Elongation at Break < 3 % DIN 53504
Coefficient of Thermal Expansion 45E-6 mm/m/°C (below Tg)
Coefficient of Thermal Expansion 160E-6 mm/m/°C (above Tg)
Thermal Conductivity 0.55 W/(m.K) -
Glass Transition Temperature (Tg) 120 °C (250°F) DSC

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